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Rigid-flex PCB Manufacturing Capabilities at PCBONLINE in 2024

PCB capability
pcbonline PCBONLINE Team Thur, Apr 25, 2024
77
rigid-flex PCB capabilities

We posted all the rigid PCB capabilities, including the diagrams, last week. On this blog page, you can check out the rigid-flex PCB capabilities at PCBONLINE.

Introduction of Rigid-flex PCBs

Rigid-flex PCBs are advanced printed circuit boards/printed wiring boards. Their inner laminate materials are PI (polyimide) and rolled annealed copper. The outer layers are FR4 PCB, and the non-wanted areas are laser cut.

rigid-flex PCB manufacturing capability

Rigid-flex PCBs integrate the advantages of both rigid and flexible PCBs and can be made high-density interconnected (HDI). You can integrate your project design into a rigid-flex PCB for flexibility, minimum space, and light weight. Rigid-flex PCBs and PCBAs (printed circuit board assemblies) are installed in the corners and folds of notebooks, smartphones, automotive ABS detectors, wearable devices, tomographs, etc.

Rigid-flex PCB Manufacturing Capabilities

Now, let's see the capabilities of rigid-flex PCBs at PCBONLINE!

Rigid-flex PCB Specs
Rigid-flex PCB capabilities at PCBONLINE
Rigid-flex PCB layer count
2-64L
Flex Layer Count
11-20L (18L)
Flex laye on outer or Middle Layer
Middle
Finished board thickness
0.2-4.0mm
Tolerance of board thickness
>1.0mm, ±10%
≤1.0mm, ±0.1mm
Min. flex layer width
2.5mm
Min. flex layer width between rigid layers
3mm
2mm (limit)
Max. panel size
406x736mm
Min. panel size
10x15mm
Materials
Adhesive flex core
SF305: PI=0.5mil, 1mil, 2mil; Cu=0.33oz, 0.5OZ, 1OZ;
R-F777 PI=1mil, 2mil, 3mil, 4mil ,Cu =0.5oz, 1oz
Adhesiveless core
Panasonic RF-775 (ED): PI=1mil, 2mil, 3mil; Cu=0.5OZ, 1OZ, 2oz
DuPont AP: PI=1mil, 2mil, 3mil; Cu=0.5 OZ, 1OZ
Thinflex W: PI=1mil, 2mill; Cu=0.5 OZ, 1OZ
at least 15/15mil
Shengyi SF305C series: 0515, 0525, 1025, 1035, 2030
TaiFlex FHK series: 0515, 0525, 1025, 1035, 2025
DuPont FR series: 0513 (FR7001), 1025 (FR0110)
Thermosetting adhesive
TaiFlex series: AD=10um, 25um, 40um;
SF315B: AD=25um, 40um
PI stiffener
TaiFlex MHKseries: PI=3mil, 5mil; 7mil, 9mil;
3M tape
9460, 9077, 9458, 6677, 5907, 4920, 467MP
Low-flow prepreg (PP)
VT-47N; VT-901LF; EM-37B
Normal FR4
IT-180A; S1141, S1000-2; TU-768 (TU-752)
Special FR4
Arlon: 85N; Rogers: RO4350B series; Ventec: VT-901; M6 series: R-5775; TUC: TU-872SLK, TU-862HF
Impedance tolerance
Single-ended: ±3Ω (≤50Ω), ±8% (>50Ω)
Differential pair: ±4Ω (≤50Ω), ±8% (>50Ω)
HDI type
3+n+3 (n buried hole≤0.4mm)
Min. Twist & Warp
0.75% (symmetrical);
1.5% (asymmetrical)
Adhesive dispense width
1.5±0.5mm (slot width≥5mm))
Min. distance between R-F connect area to conductors
0.3mm (Half depth slot process)
0.5mm normal
Min. width of resin flow out in R-F connect area
0.5mm
1.0mm normal
Min. distance between E-test pads
3mil
4mil normal
Min. inner layer line width/space before compensation
Finished copper thickness18um
3.5mil (partial3.2mil)/3mil (partial3mil)
Finished copper thickness 35um
3.5mil (partial3.2mil)/3.5mil (partial3mil)
Finished copper thickness 70um
5.5mil (partial5mil)/4.5mil (partial4.2mil)
Inner layer grid
Finished copper thickness 18um
5/5mil (after compensation)
Finished copper thickness 35um
6.5/5mil (after compensation)
Finished copper thickness 70um
10/8mil (after compensation)
Min. Inner layer annual ring width (IPCIII, before compensation)
4mil (≤6L), 8mil (7-11L), 12mil (≥12L)
Min. annual ring single side (laser hole, before compensation)
3mil (partial 2.5mil)
4mil (partial 3.5mil)
Min. inner layer isolation strip width
8 mil
10mil normal
Min. inner layer isolation annual ring width
5mil (≤6L), 6mil (7-11L), 10mil (≥12L)
Max. inner layer finished copper thickness
3oz
Min. distance between inner layer conductor and outline
8 mil
10mil
Min. external layer line width/space before compensation (Rigid on top/bottom)
Finished copper thickness, before compensation
3.2mil (partial3.0mil)/3.0mil (partial3.0mil)
Finished copper thickness 35um, before compensation
3.5mil (partial3.2mil)/3.5mil (partial3.0mil)
Finished copper thickness 70um, before compensation
5.5mil (parital5.0mil)/5mil (partial4.5mil)
Min. external layer line width/space before compensation (Flex on top/bottom)
Finished copper thickness, before compensation
5.0mil (partial4.5mil)/4.5mil (4.2mil)
Finished copper thickness 35um, before compensation
5.5mil (partial5.0mil)/5.0mil (partial4.5mil)
Finished copper thickness 70um, before compensation
7.0mil (partial6.5mil)/ 6.0mil (partial5.5mil)
Min. annual ring for PTH in external layer (class II)
Finished copper thickness, before compensation
4mil
Finished copper thickness 35um, before compensation
5mil
Finished copper thickness 70um, before compensation
8mil
Min. annual ring for PTH in external layer (class III)
Finished copper thickness, before compensation
5mil
Finished copper thickness 35um, before compensation
6mil
Finished copper thickness 70um, before compensation
9mil
Min. gap between line and line on copper filling layer (before compensation)
5/6mil (partial4/5mil)
Min. gaps between pad to line and pad to pad on copper filling layer (before compensation)
5/5.5mil (partial4/4.5mil)
Min. gap between lines on resin filling layer (before compensation)
5/6mil (partial4/5mil)
Min. gaps between pad to line and pad to pad on resin filling layer (before compensation)
5/5.5mil (partial4/4.5mil)
Min. BGA pad size
10mil (electrical Ni/Au7mil)
12mil (Electrical Ni/Au8mil) normal
Max. dry film tenting hole
6.5mm
4.5mm normal
Min. distance between NPTH edge to external conductor before compensation
6mil
Max. external finished copper thickness
5 oz
4.5mm normal
Min. distance between external conductor and outline
8mil
4.5mm normal
Min. external PTH annual ring single side, before compensation
<35um finished copper thickness
4mil (<2mm); 6mil (2-4.5mm); 10mil (4.6-6.5mm)
35-70um finished copper thickness
5mil (<2mm); 8mil (2-4.5mm); 14mil (4.6-6.5mm)
>70um finished copper thickness
7mil (<2mm); 12mil (2-4.5mm); 18mil (4.6-6.5mm)
Drilling
Min. mechanical drill size
0.15mm (≤1.6mm)
0.2mm (≤2.5mm)
Min. half-hole (pth) size
0.3mm
Laser blind via size
4mil-6mil (advance6mil)
Max. buried hole size
0.4mm
Max. drill hole size
6.3mm
Max. A/R for through hole
12:1
Max. A/R for laser blind hole
0.8:1
Min. gap between hole wall and conductor before compensation
5mil (≤6L), 6mil (7-11L), 10mil (≥12L) (after compensation)
Min. space between laser holes and conductor
6mil
Min. tolerance of NPTH
±2mil (limited+0, -2mil or +2mil, -0)
Slot drill bit diameter
0.40-1.60mm (board thickness≤2.50mm)
Tolerance of countersink
±0.15mm
Countersink hole size tolerance
±0.15mm
Min. distance between PTH hole wall and rigid-flex connect area
0.5mm (after compensation)
Min. distance between PTH holes
10mil (after compensation)
12mil normal (after compensation)
Solder mask
Min. solder mask bridge (copper ≤1oz)
4mil (Green, Red, Blue), 5mil (Black), 8.0mil (on big copper area)
Min. solder mask bridge (copper 2-4oz)
6mil,
8mil (on big copper area)
Min. solder mask opening larger than pad single side
2.5mil (partial 2mil)
Min. solder mask opening lsrger than NPTH hole signle side
4mil
Min. width of soldermask cover line (singleside)
2.5mil (partial1.5mil)
Max. finished hole size for via filled with Soldermask both side tenting
0.9mm
Max. solder mask plugging via in pad with both sides opening
0.55mm
Solder mask color
Green/matte green/Black/Blue/Red/White
Silk screen color
white/yellow/black
Carbon ink
Carbon thickness
NA
Min. gap between carbon pads
15mil
Min. gap between carbon and pads
10mil
Carbon pad larger than covering pad single side
4mil
Peelable mask
thickness
0.2-0.8mm
0.2-0.5mm normal
Outline
Min. space between the central line of non-copper-exposed V-cut to internal/external circuits (H means board thickness)
H≤40mil: 12mil (20°mean V-cut angle),
13mil (30°),
14.6mil (45°)
40
63
94.5
V-cut offset tolerance
±4mil
V-cut board thickness
0.4-3.2mm
≤0.6mm one side V-cut
Tolerance of V-cut angle
±5°
V-cut angle
20°, 30°, 45°
Min. space for jump V-cut (0.8
8.5mm
Min. space for jump V-cut (1.6
11mm
Min. space for jump V-cut (2.4
18mm
Gold finger bevelling angle
20°, 30°, 45°, 60°
Gold finger bevelling tolerance
±5°
Gold finger bevelling remained thickness tolerance
±5mil
Min. distance between gold finger and tab
7mm
Min. gap between the side of gold finger and the outline edge line
8mil
Min. internal radius
0.3mm
Depth tolerance of depth-control groove milling
±0.10mm
Outline tolerance
±0.1mm
Rout slot tolerance (NPTH)
±0.10mm
Rout slot tolerance (PTH)
±0.13mm
Drill slot tolerance (NPTH length/width≥2)
±0.05mm
Drill slot tolerance (PTH length/width≥2)
±0.075mm
Drill slot tolerance (NPTH length/width<2)
±0.075mm
Drill slot tolerance (PTH length/width<2)
±0.1mm
The tolerance between Fiducial mark pad to Fiducial mark pad
≤300mm ±4mil
300-400mm ±5mil
400-500mm ±6mil
>500mm ±7mil
IPC Class 3
Yes
Certification
ISO 9001
Yes
ISO 14001
Yes
TS16949
NA
ISO13485
NA
TL9000
NA
AS9100
NA
OHSAS18001
On planning
QC080000
NA
SA8000
On planning
UL number
Yes
UL number (Canada)
Others Certificate
NA

One-Stop Rigid-flex PCB Manufacturer PCBONLINE

You've checked all the details of rigid-flex PCB manufacturing capabilities at the one-stop PCB/PCBA manufacturer PCBONLINE. Its rigid-flex PCB capabilities and certifications match the requirements for middle and high-end applications used in automotive, computers, commercial, and communication industries.

rigid-flex PCB assembly PCBONLINE

PCBONLINE offers one-on-one engineering support and can reduce your rigid-flex electronics project through PCB design optimization and choosing alternative components.

Being a source factory manufacturer with two larger advanced PCB manufacturing bases and one PCB assembly factory, PCBONLINE provides cost-effective rigid-flex PCB manufacturing and assembly. Don't hesitate to email PCBONLINE at info@pcbonline.com to turn your ideas into real boards and devices.


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