We posted all the rigid PCB capabilities, including the diagrams, last week. On this blog page, you can check out the rigid-flex PCB capabilities at PCBONLINE.
Introduction of Rigid-flex PCBs
Rigid-flex PCBs are advanced printed circuit boards/printed wiring boards. Their inner laminate materials are PI (polyimide) and rolled annealed copper. The outer layers are FR4 PCB, and the non-wanted areas are laser cut.
Rigid-flex PCBs integrate the advantages of both rigid and flexible PCBs and can be made high-density interconnected (HDI). You can integrate your project design into a rigid-flex PCB for flexibility, minimum space, and light weight. Rigid-flex PCBs and PCBAs (printed circuit board assemblies) are installed in the corners and folds of notebooks, smartphones, automotive ABS detectors, wearable devices, tomographs, etc.
Rigid-flex PCB Manufacturing Capabilities
Now, let's see the capabilities of rigid-flex PCBs at PCBONLINE!
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Rigid-flex PCB Specs
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Rigid-flex PCB capabilities at PCBONLINE
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Rigid-flex PCB layer count
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2-64L
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Flex Layer Count
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11-20L (18L)
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Flex laye on outer or Middle Layer
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Middle
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Finished board thickness
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0.2-4.0mm
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Tolerance of board thickness
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>1.0mm, ±10%
≤1.0mm, ±0.1mm |
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Min. flex layer width
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2.5mm
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Min. flex layer width between rigid layers
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3mm
2mm (limit) |
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Max. panel size
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406x736mm
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Min. panel size
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10x15mm
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Materials
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Adhesive flex core
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SF305: PI=0.5mil, 1mil, 2mil; Cu=0.33oz, 0.5OZ, 1OZ;
R-F777 PI=1mil, 2mil, 3mil, 4mil ,Cu =0.5oz, 1oz |
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Adhesiveless core
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Panasonic RF-775 (ED): PI=1mil, 2mil, 3mil; Cu=0.5OZ, 1OZ, 2oz
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DuPont AP: PI=1mil, 2mil, 3mil; Cu=0.5 OZ, 1OZ
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Thinflex W: PI=1mil, 2mill; Cu=0.5 OZ, 1OZ
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at least 15/15mil
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Shengyi SF305C series: 0515, 0525, 1025, 1035, 2030
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TaiFlex FHK series: 0515, 0525, 1025, 1035, 2025
DuPont FR series: 0513 (FR7001), 1025 (FR0110) |
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Thermosetting adhesive
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TaiFlex series: AD=10um, 25um, 40um;
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SF315B: AD=25um, 40um
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PI stiffener
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TaiFlex MHKseries: PI=3mil, 5mil; 7mil, 9mil;
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3M tape
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9460, 9077, 9458, 6677, 5907, 4920, 467MP
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Low-flow prepreg (PP)
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VT-47N; VT-901LF; EM-37B
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Normal FR4
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IT-180A; S1141, S1000-2; TU-768 (TU-752)
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Special FR4
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Arlon: 85N; Rogers: RO4350B series; Ventec: VT-901; M6 series: R-5775; TUC: TU-872SLK, TU-862HF
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Impedance tolerance
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Single-ended: ±3Ω (≤50Ω), ±8% (>50Ω)
Differential pair: ±4Ω (≤50Ω), ±8% (>50Ω) |
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HDI type
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3+n+3 (n buried hole≤0.4mm)
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Min. Twist & Warp
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0.75% (symmetrical);
1.5% (asymmetrical) |
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Adhesive dispense width
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1.5±0.5mm (slot width≥5mm))
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Min. distance between R-F connect area to conductors
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0.3mm (Half depth slot process)
0.5mm normal |
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Min. width of resin flow out in R-F connect area
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0.5mm
1.0mm normal |
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Min. distance between E-test pads
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3mil
4mil normal |
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Min. inner layer line width/space before compensation
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Finished copper thickness18um
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3.5mil (partial3.2mil)/3mil (partial3mil)
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Finished copper thickness 35um
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3.5mil (partial3.2mil)/3.5mil (partial3mil)
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Finished copper thickness 70um
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5.5mil (partial5mil)/4.5mil (partial4.2mil)
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Inner layer grid
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Finished copper thickness 18um
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5/5mil (after compensation)
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Finished copper thickness 35um
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6.5/5mil (after compensation)
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Finished copper thickness 70um
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10/8mil (after compensation)
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Min. Inner layer annual ring width (IPCIII, before compensation)
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4mil (≤6L), 8mil (7-11L), 12mil (≥12L)
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Min. annual ring single side (laser hole, before compensation)
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3mil (partial 2.5mil)
4mil (partial 3.5mil) |
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Min. inner layer isolation strip width
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8 mil
10mil normal |
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Min. inner layer isolation annual ring width
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5mil (≤6L), 6mil (7-11L), 10mil (≥12L)
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Max. inner layer finished copper thickness
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3oz
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Min. distance between inner layer conductor and outline
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8 mil
10mil |
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Min. external layer line width/space before compensation (Rigid on top/bottom)
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Finished copper thickness, before compensation
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3.2mil (partial3.0mil)/3.0mil (partial3.0mil)
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Finished copper thickness 35um, before compensation
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3.5mil (partial3.2mil)/3.5mil (partial3.0mil)
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Finished copper thickness 70um, before compensation
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5.5mil (parital5.0mil)/5mil (partial4.5mil)
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Min. external layer line width/space before compensation (Flex on top/bottom)
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Finished copper thickness, before compensation
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5.0mil (partial4.5mil)/4.5mil (4.2mil)
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Finished copper thickness 35um, before compensation
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5.5mil (partial5.0mil)/5.0mil (partial4.5mil)
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Finished copper thickness 70um, before compensation
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7.0mil (partial6.5mil)/ 6.0mil (partial5.5mil)
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Min. annual ring for PTH in external layer (class II)
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Finished copper thickness, before compensation
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4mil
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Finished copper thickness 35um, before compensation
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5mil
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Finished copper thickness 70um, before compensation
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8mil
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Min. annual ring for PTH in external layer (class III)
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Finished copper thickness, before compensation
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5mil
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Finished copper thickness 35um, before compensation
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6mil
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Finished copper thickness 70um, before compensation
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9mil
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Min. gap between line and line on copper filling layer (before compensation)
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5/6mil (partial4/5mil)
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Min. gaps between pad to line and pad to pad on copper filling layer (before compensation)
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5/5.5mil (partial4/4.5mil)
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Min. gap between lines on resin filling layer (before compensation)
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5/6mil (partial4/5mil)
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Min. gaps between pad to line and pad to pad on resin filling layer (before compensation)
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5/5.5mil (partial4/4.5mil)
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Min. BGA pad size
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10mil (electrical Ni/Au7mil)
12mil (Electrical Ni/Au8mil) normal |
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Max. dry film tenting hole
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6.5mm
4.5mm normal |
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Min. distance between NPTH edge to external conductor before compensation
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6mil
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Max. external finished copper thickness
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5 oz
4.5mm normal |
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Min. distance between external conductor and outline
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8mil
4.5mm normal |
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Min. external PTH annual ring single side, before compensation
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<35um finished copper thickness
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4mil (<2mm); 6mil (2-4.5mm); 10mil (4.6-6.5mm)
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35-70um finished copper thickness
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5mil (<2mm); 8mil (2-4.5mm); 14mil (4.6-6.5mm)
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>70um finished copper thickness
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7mil (<2mm); 12mil (2-4.5mm); 18mil (4.6-6.5mm)
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Drilling
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Min. mechanical drill size
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0.15mm (≤1.6mm)
0.2mm (≤2.5mm) |
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Min. half-hole (pth) size
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0.3mm
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Laser blind via size
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4mil-6mil (advance6mil)
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Max. buried hole size
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0.4mm
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Max. drill hole size
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6.3mm
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Max. A/R for through hole
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12:1
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Max. A/R for laser blind hole
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0.8:1
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Min. gap between hole wall and conductor before compensation
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5mil (≤6L), 6mil (7-11L), 10mil (≥12L) (after compensation)
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Min. space between laser holes and conductor
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6mil
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Min. tolerance of NPTH
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±2mil (limited+0, -2mil or +2mil, -0)
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Slot drill bit diameter
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0.40-1.60mm (board thickness≤2.50mm)
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Tolerance of countersink
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±0.15mm
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Countersink hole size tolerance
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±0.15mm
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Min. distance between PTH hole wall and rigid-flex connect area
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0.5mm (after compensation)
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Min. distance between PTH holes
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10mil (after compensation)
12mil normal (after compensation) |
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Solder mask
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Min. solder mask bridge (copper ≤1oz)
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4mil (Green, Red, Blue), 5mil (Black), 8.0mil (on big copper area)
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Min. solder mask bridge (copper 2-4oz)
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6mil,
8mil (on big copper area) |
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Min. solder mask opening larger than pad single side
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2.5mil (partial 2mil)
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Min. solder mask opening lsrger than NPTH hole signle side
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4mil
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Min. width of soldermask cover line (singleside)
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2.5mil (partial1.5mil)
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Max. finished hole size for via filled with Soldermask both side tenting
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0.9mm
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Max. solder mask plugging via in pad with both sides opening
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0.55mm
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Solder mask color
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Green/matte green/Black/Blue/Red/White
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Silk screen color
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white/yellow/black
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Carbon ink
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Carbon thickness
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NA
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Min. gap between carbon pads
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15mil
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Min. gap between carbon and pads
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10mil
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Carbon pad larger than covering pad single side
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4mil
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Peelable mask
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thickness
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0.2-0.8mm
0.2-0.5mm normal |
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Outline
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Min. space between the central line of non-copper-exposed V-cut to internal/external circuits (H means board thickness)
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H≤40mil: 12mil (20°mean V-cut angle),
13mil (30°), 14.6mil (45°) |
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40
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63
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94.5
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V-cut offset tolerance
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±4mil
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V-cut board thickness
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0.4-3.2mm
≤0.6mm one side V-cut |
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Tolerance of V-cut angle
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±5°
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V-cut angle
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20°, 30°, 45°
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Min. space for jump V-cut (0.8 |
8.5mm
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Min. space for jump V-cut (1.6 |
11mm
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Min. space for jump V-cut (2.4 |
18mm
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Gold finger bevelling angle
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20°, 30°, 45°, 60°
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Gold finger bevelling tolerance
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±5°
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Gold finger bevelling remained thickness tolerance
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±5mil
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Min. distance between gold finger and tab
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7mm
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Min. gap between the side of gold finger and the outline edge line
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8mil
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Min. internal radius
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0.3mm
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Depth tolerance of depth-control groove milling
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±0.10mm
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Outline tolerance
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±0.1mm
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Rout slot tolerance (NPTH)
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±0.10mm
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Rout slot tolerance (PTH)
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±0.13mm
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Drill slot tolerance (NPTH length/width≥2)
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±0.05mm
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Drill slot tolerance (PTH length/width≥2)
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±0.075mm
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Drill slot tolerance (NPTH length/width<2)
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±0.075mm
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Drill slot tolerance (PTH length/width<2)
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±0.1mm
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The tolerance between Fiducial mark pad to Fiducial mark pad
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≤300mm ±4mil
300-400mm ±5mil 400-500mm ±6mil >500mm ±7mil |
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IPC Class 3
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Yes
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Certification
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ISO 9001
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Yes
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ISO 14001
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Yes
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TS16949
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NA
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ISO13485
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NA
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TL9000
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NA
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AS9100
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NA
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OHSAS18001
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On planning
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QC080000
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NA
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SA8000
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On planning
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UL number
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Yes
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UL number (Canada)
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Others Certificate
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NA
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One-Stop Rigid-flex PCB Manufacturer PCBONLINE
You've checked all the details of rigid-flex PCB manufacturing capabilities at the one-stop PCB/PCBA manufacturer PCBONLINE. Its rigid-flex PCB capabilities and certifications match the requirements for middle and high-end applications used in automotive, computers, commercial, and communication industries.
PCBONLINE offers one-on-one engineering support and can reduce your rigid-flex electronics project through PCB design optimization and choosing alternative components.
Being a source factory manufacturer with two larger advanced PCB manufacturing bases and one PCB assembly factory, PCBONLINE provides cost-effective rigid-flex PCB manufacturing and assembly. Don't hesitate to email PCBONLINE at info@pcbonline.com to turn your ideas into real boards and devices.
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PCB fabrication at PCBONLINE.pdf
PCB fabrication at PCBONLINE.pdf
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