High Frequency PCB Manufacturing 100% Successful - From Materials to Assembly All at One-Stop

The base materials take up the most ratio in the microwave PCB price, and because of that, PCBONLINE always pays attention to ensure the materials' best performance and stability. You will find materials accessible to PCBONLINE below:

Specifications of high speed, RF, and microwave PCBs manufactured by PCBONLINE are below:

• 1. Low water absorption. Moisture affects dielectric constant (Dk) and dielectric loss (Df) of high frequency/high speed PCBs.

• 2. Consistent thermal expansion coefficient of the PCB substrate and copper foil. If that is ignored, then copper foil separation may happen.

• 3. Small and stable dielectric constant (Dk). The smaller Dk, the better RF microwave PCBs. Because of the signal transmission rate and the square root of the material, Dk is inversely proportional. High Dk is easy to cause signal transmission delay.

• 4. Small dielectric loss (Df). Df mainly affects the quality of signal transmission. The smaller Df, the smaller signal loss.

• 5. High heat resistance, chemical resistance, impact strength, and peel strength.

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• 1. The line width tolerance of HF PCBs is usually ±0.02mm (but can even be ±0.015mm). Therefore, from the perspective of engineering data, our engineers will compensate the line widths according to different copper thicknesses and measure the etched board to confirm whether it is within the tolerance range.

• 2. Pit, notches, pinholes, and other defects in the circuit line will affect the transmission effect, and any such minor defects are not allowed in the high-frequency PCB layout. Therefore, after the film is drawn, it must be checked to ensure no pinholes or gaps in the film. The most difficult procedure of high frequency PCB fabrication is chemical copper sinking. All holes must have copper and no blank. PCBONLINE adopts the Plasma method, which is to inject carbon tetrafluoride (CF₄) or argon (Ar₂) nitrogen (N₂) and oxygen (O₂) between two high-pressure electrodes under the vacuum environment. The HF PCB is placed between two electrodes, and the Plasma is formed in the cavity to remove the drilling dirt and dirt in the hole.

• 3. Solder resistance thickness is also strictly controlled. Because too thick or too thin lines solder masks for several microns can be disqualified.

• 4. The final destructive test is carried out in manufacturing: thermal shock at 288℃, for 10 seconds, for 1 to 3 times, to ensure no separation of hole wall.

Leading manufacturing capability leads to HF circuit boards of prominent quality. Below is the tech specs of our high frequency PCB:

A.Common stock sheet and parameters

B.Performance index

High-frequency board performance and production process is special, in order to produce the best products, the manufacturer must have rich experience in processing production. PCBONLINE high-frequency PCB manufacturing is controlled from the following points:

• 1. The line width tolerance of the printed circuit board is usually ±0.02mm (even ±0.015mm). Therefore, from the perspective of engineering data, our engineers will compensate the line width according to different copper thickness, and the etched board will measure the line width 100% to confirm whether it is within the tolerance range.
• 2. Pit, notches, pinholes and other defects in the circuit line will affect the transmission effect, and any such minor defects are not allowed in the high-frequency PCB layout. Therefore, after the film is drawn, it must be checked to ensure that there are no pinholes or gaps in the film. The most difficult procedure of high-frequency board fabrication is chemical copper sinking. All holes must have copper and no blank. PCBONLINE adopts Plasma method, which is to inject carbon tetrafluoride (CF4) or argon (Ar2) nitrogen (N2) and oxygen (O2) gas between two high-pressure electrodes under the vacuum environment. The printed board is placed between two electrodes, and the Plasma is formed in the cavity, so as to remove the drilling dirt and dirt in the hole.
• 3. Solder resistance thickness is also strictly controlled and lines solder mask too thick or too thin for several microns can be disqualified.
• 4. The final destructive test must be carried out in manufacturing: thermal shock 288℃, 10 seconds, 1~3 times, to ensure no separation of hole wall.