Three Types of High-Frequency PCBs at PCBONLINE
- High-speed/high-frequency PCBs transmit and receive 50MHz to 100GHz high-speed/microwave/radio frequency signals. PCBONLINE manufactures and assembles 6GHz to 24 GHz, 77GHz, and embedded antenna PCBs.
- ● RF 6GHz to 24GHz PCBs: RF 6GHz to 24GHz PCBs are used for signal emission and reception within 30 meters. The circuit generates a radar lobe, and the PCBs' antenna structure emits it. The radar lobe is reflected by the object and received by the antenna structure. To optimize circuit functions, PCBONLINE uses base materials of higher frequencies and manufactures the boards to have a stable dielectric constant (Epsilon r) and low dielectric loss (tan delta).
- ● RF 77GHz PCBs: RF 77GHz PCBs are used for signal emission and reception at a longer distance and provide a higher resolution. In a PCB radar, two antennas are integrated into the circuit board as the etched copper structure. One antenna is the radar wave transmitter, and the other is the radar wave receiver. The high-frequency circuit generates the waves and evaluates the reflected signal. Usually, the RF part on the front side of the high-frequency PCB emits the wave, and the digital circuit on the backside evaluates the reflected signals. PCBONLINE manufactures RF 77GHz PCBs to have a much smaller antenna structure, conductor geometry, and manufacturing tolerances.
- ● Embedded Antenna PCBs: Embedded antenna PCBs are developed from RF 77GHz PCBs. The conductive pattern on the PCB's RF layer is embedded in the RF material so that the PCB can be manufactured to have a small conductor width, small conductor spacing, minimized conductor tolerance, and rounded corners. Besides, accurate mapping of the antenna layout improves the RF performance and reduces power consumption. PCBONLINE's embedded antenna DFM can minimize the PCB's conductor tolerance and corner roundness/roughness.
High-Frequency PCB Manufacturing at PCBONLINE
PCBONLINE provides one-stop high-frequency PCB manufacturing, from choosing PCB materials, prototyping, to batch PCB assembly and testing. Here are some key points in high-frequency PCB manufacturing from PCBONLINE.
● Our engineers compensate the trace width according to different copper thicknesses and measure the etched copper thickness to confirm it is within the tolerance range of ±0.02mm (but can even be ±0.015mm).
● After the film is drawn, we check and make sure no pinholes or gaps in the film. Pit, notches, pinholes, and other defects in the circuit lines will affect the transmission effect, and we allow no such minor defects in the high-frequency PCBs.
● We adopt the Plasma method for chemical copper sinking, which is the most difficult procedure of high-frequency PCB fabrication. All holes must have copper and we allow no blank. We inject carbon tetrafluoride (CF₄) or argon (Ar₂) nitrogen (N₂) and oxygen (O₂) between two high-pressure electrodes under the vacuum environment, and we place the high-frequency PCB between two electrodes. In this way, the Plasma is formed in the cavity to remove the drilling dirt and dirt in the hole.
● Solder resistance thickness is also strictly controlled. Because too thick or too thin lines solder masks for several microns can be disqualified.
● The final destructive test is carried out in manufacturing: thermal shock at 288℃ for 10 seconds, for 1 to 3 times, to ensure no separation of hole wall.
Besides, engineers from PCBONLINE will have comprehensive coordination with you throughout your high-frequency/high-speed PCB project. With a correct understanding of your needs and product functionality, PCBONLINE can provide you with useful improvement suggestions and manufacture high-frequency PCBs yielding satisfying results.
Advantages of High-Frequency/High-Speed PCBs
- High-frequency PCBs usually adopt the PTFE or ceramic hybrid materials for the substrate and thus have these advantages:
- ● Have a small and stable dielectric constant (Dk), which prevents signal transmission delay.
- ● Have a small and stable dielectric loss (Df), which reduces RF microwave signal losses.
- ● Have a low and consistent thermal expansion coefficient (CTE), which prevents copper foil separation.
- ● Have a good impact strength, peel strength. and thermal/chemical resistance.