High Frequency PCB Manufacturing 100% Successful - From Materials to Assembly All at One-Stop

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High Frequency PCB Manufacturing at PCBONLINE

  • There are many high frequency PCB manufacturers, so why should you choose PCBONLINE? PCBONLINE has high-quality base materials in stock and a core technology specializing in expansion and contraction control.
  • PCBONLINE manufactures and assembles high frequency PCBs, including high speed PCBs and RF Microwave PCBs. We understand that base materials are the key to high frequency PCB quality, and because of that, our storage time for high frequency materials is no more than 45 days.
  • Besides high-quality high frequency PCBs, manufacturing at PCBONLINE enjoys free one-on-one engineering support. PCBONLINE will assist you in every step of your high-frequency PCB project until you receive satisfying results!

All about High Frequency/High Speed PCBs

Technical Advantages of High Frequency PCB Manufacturing at PCBONLINE

  • ◆ Directly imported U.S. Rogers, Taconic, Arlon, and many other different materials are stored ready to use.
  • ◆ Strict impedance control and line widths to always be within the 2% tolerance range.
  • ◆ Can make high frequency hybrid PCBs, 8mm finished thickness high frequency PCBs, and copper/ceramic base high frequency PCBs.
  • ◆ Store diverse HF materials such as PTFE, ceramics, FR4, ceramic-filled PTFE, ceramic filled with hydrocarbon, etc.
  • ◆ Insist on using high-quality materials of low Dk, Df, thermal expansion coefficient, and water absorption.
  • ◆ Grasp the core technology to minimize the expansion and contraction control of the RF microwave PCBs.
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Explore More about the High Speed RF Microwave PCB Manufacturer PCBONLINE

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High Frequency PCB Materials and Specifications

The base materials take up the most ratio in the microwave PCB price, and because of that, PCBONLINE always pays attention to ensure the materials' best performance and stability. You will find materials accessible to PCBONLINE below:

PTFE HF PCB Materials Suppliers Material Series Models
Rogers RT5000 RT5880, RT5870
RT6000 RT6002, RT6006
RT6010LM
RO3000 RO3003, RO3006
RO3203, RO3210
RO3010
RO3206
RO3035HTC
Ultralam 3000 Ultralam 3850
Ultralam 2000 Ultralam 2000
Taizhou Wangling F4B F4B-2
TF-1, 2 TF-1, 2
TP-2 TP-2
F4D-2 F4D-2
TP-12 TP-12
Nelco NX9000 NX9240, NX9245, NX9250, NX9255, NX9260, NX9294, NX9300, NX9320...
NY9000 NY9208, NY9217, NY9220, NY9233...
NH9000 NH9294, NH9300, NH9320, NH9338, NH9348, NH9350...
Taconic TLX TLX-0, TLX-6, TLX-7
TLX-8, TLX-8-CL1, TLX-9
TLY TLY-3, TLY-5, TLY-5A
TLC TLC-27
TLC-30, TLC-32
RF RF-30
RF-60, RF-60A
RF-35, RF-35P
RF-45, RF-41
RF-35A, RF-35A2
TRF-45, TRF-43, TRF-41
TF-2
TLT TLT-7, TLT-8, TLT-9
TLT-0, TLT-6
TL TL-32, TL-35
TLF TLF-35
TLK TLK-8
TLA TLA-6
RF RF-35TC
other CER10, TSM-30
TLX-9 TLX-9-0200
Arlon Diclad Diclad522
Diclad527
Diclad870
Diclad880
Cuclad Cuclad250GT
Cuclad250LX
Cuclad250GX
Cuclad233LX, Cuclad233GY
Cuclad217LX, Cuclad 217GY
Isoclad Isoclad933
Isoclad917
AD AD250, AD255, AD255A, AD255C, AD255IM, AD255L
AD260A, AD270
AD350, AD350A
AD300, AD320, AD300C, AD300A
AD410, AD450, AD600
AD1000, AD10
other AR1000
CLTE, CLTE-LC, CLTE-AT, CLTE-XT
TC350, TC600, EP-2
PI HF PCB Materials Supplier (Non FR4) Tg Models
Arlon high Tg >250 85N
85NT
35N
35N
Ventec high Tg >250 VT-90H
VT-901
Nelco high Tg >250 N7000-2 HT
N7000-2 HT

Specifications of high speed, RF, and microwave PCBs manufactured by PCBONLINE are below:

Characteristics Capabilities
Quality Grade IPC Class 3
Layer Number 2-24
Conductor width control ±0.02mm
Hole wall copper ≥ 20μм
Thermal stress 10 seconds at 288°C
Permittivity ε2.1-10.0
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What are the Features of HF Materials that PCBONLINE Uses

PCBONLINE uses and advises clients to use substrate materials that have these properties:

  • 1. Low water absorption. Moisture affects dielectric constant (Dk) and dielectric loss (Df) of high frequency/high speed PCBs.

  • 2. Consistent thermal expansion coefficient of the PCB substrate and copper foil. If that is ignored, then copper foil separation may happen.

  • 3. Small and stable dielectric constant (Dk). The smaller Dk, the better RF microwave PCBs. Because of the signal transmission rate and the square root of the material, Dk is inversely proportional. High Dk is easy to cause signal transmission delay.

  • 4. Small dielectric loss (Df). Df mainly affects the quality of signal transmission. The smaller Df, the smaller signal loss.

  • 5. High heat resistance, chemical resistance, impact strength, and peel strength.

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How is the High Frequency PCB Manufacturing at PCBONLINE

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  • 1. The line width tolerance of HF PCBs is usually ±0.02mm (but can even be ±0.015mm). Therefore, from the perspective of engineering data, our engineers will compensate the line widths according to different copper thicknesses and measure the etched board to confirm whether it is within the tolerance range.

  • 2. Pit, notches, pinholes, and other defects in the circuit line will affect the transmission effect, and any such minor defects are not allowed in the high-frequency PCB layout. Therefore, after the film is drawn, it must be checked to ensure no pinholes or gaps in the film. The most difficult procedure of high frequency PCB fabrication is chemical copper sinking. All holes must have copper and no blank. PCBONLINE adopts the Plasma method, which is to inject carbon tetrafluoride (CF₄) or argon (Ar₂) nitrogen (N₂) and oxygen (O₂) between two high-pressure electrodes under the vacuum environment. The HF PCB is placed between two electrodes, and the Plasma is formed in the cavity to remove the drilling dirt and dirt in the hole.

  • 3. Solder resistance thickness is also strictly controlled. Because too thick or too thin lines solder masks for several microns can be disqualified.

  • 4. The final destructive test is carried out in manufacturing: thermal shock at 288℃, for 10 seconds, for 1 to 3 times, to ensure no separation of hole wall.

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Tech Specifications

Leading manufacturing capability leads to HF circuit boards of prominent quality. Below is the tech specs of our high frequency PCB:

A.Common stock sheet and parameters

HF PCB
Type
Thickness(mm)
er
F4B
F4B F4B F4B F4Bk F4B FE=F4BM
0.38 0.55 0.225、0.3、0.5、08、1、1.2、1.5、2、2.5、3.0 0.8、1.5 0.8 1
2.2 2.23 2.65 2.65 3.5 2.2
Rogers
RO3533 RO4350 RO4003
0.8 0.254 0.508、0.8、1.524 0.508
3.3 3.5 3.38
TACONIC
TLF-35 TLA-6 TLX-8 RF-60A TLY-5 TLC-32 TLA-35
0.8 0.254、0.8、1、1.5 0.254、0.8、1、1.6 0.64 0.254、0.508、0.8 0.8、1.5、3 0.8
3.5 2.65 2.55 6.15 2.2 3.2 3.2
ARLON
AD255C06099C MCG0300CG AD0300C AD255C03099C AD255C04099C DLC220
1.5 0.8 0.8 0.8 1 1
2.55 3.7 3 2.55 2.55 2

B.Performance index

Parameter
Value
Conductor width control
±0.02mm
Hole wall copper
≥ 20μм
Thermal stress
288°C.10sec.
Permitivity
ε2.1-10.0
Profile:punching or routing.tolerance
±0.10.0-0.13mm
final product thickness
0.5,0.8,1.0,1.2,1.6mm
Base copper thickness
Normal 0.5 1.0 OZ
Solder Mask
Taiyo PSR4000.Tamura DSR2200
Solder mask thickness on tracks
20-30 μм
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Manufacturing Experience from PCBONLINE

High-frequency board performance and production process is special, in order to produce the best products, the manufacturer must have rich experience in processing production. PCBONLINE high-frequency PCB manufacturing is controlled from the following points:

  • 1. The line width tolerance of the printed circuit board is usually ±0.02mm (even ±0.015mm). Therefore, from the perspective of engineering data, our engineers will compensate the line width according to different copper thickness, and the etched board will measure the line width 100% to confirm whether it is within the tolerance range.
  • 2. Pit, notches, pinholes and other defects in the circuit line will affect the transmission effect, and any such minor defects are not allowed in the high-frequency PCB layout. Therefore, after the film is drawn, it must be checked to ensure that there are no pinholes or gaps in the film. The most difficult procedure of high-frequency board fabrication is chemical copper sinking. All holes must have copper and no blank. PCBONLINE adopts Plasma method, which is to inject carbon tetrafluoride (CF4) or argon (Ar2) nitrogen (N2) and oxygen (O2) gas between two high-pressure electrodes under the vacuum environment. The printed board is placed between two electrodes, and the Plasma is formed in the cavity, so as to remove the drilling dirt and dirt in the hole.
  • 3. Solder resistance thickness is also strictly controlled and lines solder mask too thick or too thin for several microns can be disqualified.
  • 4. The final destructive test must be carried out in manufacturing: thermal shock 288℃, 10 seconds, 1~3 times, to ensure no separation of hole wall.

Our PCB Service for You

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One-Stop PCB Manufacturing

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Quick Manufacturing and Delivery

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Custom PCB Design & Assembly

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21 Years of Experience

PCBONLINE

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