Best Prototype PCB Assembly with Precise Placement & Perfect Soldering

Here are two major welding techniques of the PCB assembly.

• 1. SMT (surface-mount technology): using an SMT stencil, the soldering paste is applied on the PCB to get the desired design and layout, and the components are mounted or placed directly onto the surface of printed circuit boards.
• 2. THT (through-hole technology): a hole is drilled through the PCB, and then a component is placed over it on one side while soldering is applied on the other side.
• 3. In PCBONLINE, you can require the above two assembly techniques, and the mixxed-technique assembly is also available.

For PCB assembly, consumables and electronics parts as below are required:

• 1. Naked printed circuit boards
• 2. Primary electronic elements
• 3. Depending on the type of the process of soldering, soldering components like solder balls, solder paste, solder bar, solder perform are required.
• 4. Flux for quote soldering
• 5. Soldering technology including a wave soldering machine, soldering station, SMT tools, testing and inspection equipment etc.
• When all the above-mentioned quote components, tools and electronic parts are provided, then the PCB assembly process will be started.

Prototype PCB assembly is a non-linear process as quote concerns are involved. Generally it includes the below steps. The demanded result of the PCB assembly is one of the primary concerns directing the elements and customary circuit board assembly procedure. The procedure consists of a few automated and manual approaches for each progression.

• Step 1. Design and output.
• Step 2. From file to film.
• Step 3. Printing the inner layers.
• Step 4. Removing the unwanted copper.
• Step 5. Layer alignment and optical inspection.
• Step 6. Layer-up and bond.
• Step 7. Drill.
• Step 8. Plating and copper deposition.
• Step 9. Outer layer imaging.
• Step 10. Plating.
• Step 11. Final etching.
• Step 12. Solder mask application.
• Step 13. Surface finish.
• Step 14. Silkscreen.
• Step 15. Electrical test.
• Step 16. Profiling and V-scoring.
• The PCB testifies the goods for better improvement and goes through in-circuit testing (ICT), flying probe testing/FICT, functional circuit testing, and boundaries checking out screen. Components include technology SMT and iSO 9001.

• • Chip23,500CPH chip (Laser centering/Optimum) 18,500CPH (Laser centering / IPC9850).
• • IC9,000CPH (Vision centering / MNVC option).
• • From 0402(01005) to 33.5mm square components.
• • The use of electronic double tape feeders enables mounting of a maximum of 160 component types.
• • High-speed, on-the-fly vision centering (When using both high-resolution camera and MNVC).
• • Longer sized PWB in X-axis.
• • Three welding techniques: 1) through-hole technology (THT) - a hole is drilled through the PCB. Then component is placed over it on one side while soldering is applied on the other. 2) surface-mount technology (SMT) - using an SMT stencil, the soldering paste is applied on the PCB to get the desired design and layout, and the components are mounted or placed directly onto the surface of printed circuit boards. 3) mixed technology - the soldering applies both the THT and SMT techniques.

One of PCBONLINE's three factories is specialized in PCB assembly so we have mature assembly lines. You can check our tech specifications as below:

• Parameter

  Data

  Quality Grade

  Standard IPC-A-610 class 2

  Board Size

  M size:330*250mm L size:4FFF10*360mm L-wide size 510*360*mm*1 XL size 610*560mm Long PWB(M size)*2=650*250mm Long PWB(L size)*=800*360mm Long PWB(L-WIDE size)*2=1010*360mm Long PWB(XL size)*2=1210*560mm

  Component Height

  12mm

  Component Size

  Laser recognition:0402(01005)-33.5mm Vision recognition:MNVC 3mm*3-33.5mm Vision recognition:MNVC 1.0*0.5mm*4-20mm

  Placement Speed

  Chip: Optimum 23500CPH Chip: IPC9850 18500CPH

  Placement accuracy

  Laser recognition:±0.05mm

  Feeder inputs

  Max 160 in case of 8mm tape

  Assembly Types

  INT & SMT