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One-Stop Multilayer PCB Manufacturing from 4 to 60 Layers

"Multilayer PCBs save space and increase circuit density. PCB layers
are possible up to 60 from PCBONLINE."

Applications of Multilayer PCBs

● Computers, telecommunication
● Industrial controls, automotive
● Defense & aerospace systems
● Medical equipment
● Consumer electronics, etc.

Specifications

PCBONLINE's Multilayer PCB Capabilities

PCB layers

4 to 60

Build time

1 day to 4 weeks

Final board thickness

0.15mm to 3.2mm

Materials

FR4, polyimide, aluminum, ceramics, PTFE

Tg (FR4 multilayer PCB)

135°C, 150°C, 160°C, 170°C, 180°C, 185°C...

Aspect Ratio

(laser drill) 3:4
(PTH) 10:1

Min. drill bit size

8mil

HDI stackup

1+N+1, 2+N+2, 3+N+3 (with copper filling)

Line/space

(inner layers)2.5mil/2.5mil
(external layers)2.5mil/2.5mil

Copper thickness

1/3oz to 6oz

Warpage

0.5%

Punching profile

±3mil

Hole size tolerance

PTH: ±3mil, NPTH: ±2mil

Use high Tg Materials for multilayer PCBs by default

Special-purpose production line for immersion gold

ISO quality management system for multilayer PCB manufacturing

Multilayer flex, rigid, rigid-flex, aluminum, ceramic PCBs available

Professional one-on-one engineering support

PCB/PCBA production from prototyping to batch manufacturing

Multilayer PCB Certifications

Multilayer PCBs are circuit boards having at least 4 layers with the copper thickness of 2oz and below, such as multilayer flexible PCBs, multilayer ceramic PCBs, multilayer rigid PCBs, etc. But OSP PCBs don't belong to multilayer PCBs.
To reduce the warpage, multilayer PCBs usually have a symmetrical structure. Common layer numbers are 4, 6, 8, 10, 12, 16. Wiring is possible on up to 60 layers.
The core materials of multilayers PCBs can be FR4, aluminum, copper, polyimide, PTFE, ceramics, etc. Components can mount on one side or both sides.

Multilayer PCBs are manufactured by laminating the alternating layers of prepreg and copper on the PCB core under high temperature and pressure.

The lamination process makes sure no air is trapped in the board, the resin in the prepreg melts and cures, and the two adjacent conductive layers are bonded and insulated.

The circuit on the conductive is achieved by imaging, etching copper, and removing photoresist film. The PTH holes are drilled and electroplated to connect the circuits between different layers.

Compared with single and double-layer PCBs, multilayer PCBs provide:
● higher wiring density,
● smaller product sizes,
● more circuit design flexibility.
● Via the ground and power layers, multilayer PCBs reduce EMI (electromagnetic interference).

Laminates

Support Request

Multilayer PCB Examples

"PCBONLINE once manufactured 12-layer PCBs for a client. The PCB requires very high FPGA manufacturing precision and PAD tolerance control in engineering and fabrication. Under the microscope, the circular PADs are not deformed at all, and the integrity of the solder mask bridge is well protected."