Multilayer PCB Manufacturing Capabilities

Applications of Multilayer PCBs
- ● Computers, telecommunication
- ● Industrial controls, automotive
- ● Defense & aerospace systems
- ● Medical equipment
- ● Consumer electronics, etc.
Specifications
PCBONLINE's Multilayer PCB Capabilities
PCB layers
4 to 60
Build time
1 day to 4 weeks
Final board thickness
0.15mm to 3.2mm
Materials
FR4, polyimide, aluminum, ceramics, PTFE
Tg (FR4 multilayer PCB)
135°C, 150°C, 160°C, 170°C, 180°C, 185°C...
Aspect Ratio
(laser drill) 3:4
(PTH) 10:1
Min. drill bit size
8mil
HDI stackup
1+N+1, 2+N+2, 3+N+3 (with copper filling)
Line/space
(inner layers)2.5mil/2.5mil
(external layers)2.5mil/2.5mil
Copper thickness
1/3oz to 6oz
Warpage
0.5%
Punching profile
±3mil