Home> Blog> Rigid PCB Capabilities at PCBONLINE in 2024 [FR4, MCPCB, etc]

Rigid PCB Capabilities at PCBONLINE in 2024 [FR4, MCPCB, etc]

PCB capablities
pcbonline PCBONLINE Team Fri, Apr 19, 2024
76
relay circuit board assembly

PCBONLINE is a one-stop advanced PCB manufacturers for middle and high-end applications. As our PCB fabrication page can't display all the PCB capabilities, we share all of our PCB manufacturing capabilities for rigid PCBs, flexible PCBs, and rigid-flex PCBs in the blogs.

This page shows the rigid PCB capabilities, including FR4 PCBs, metal-core PCBs, PTFE/high-frequency PCBs, HDI PCBs, and special material PCBs.

If you find that PCBONLINE's rigid PCB capabilities match your project requirements, please do not hesitate to contact us via the online chat window.

You can see PCBONLINE's rigid PCB capabilities below. For you to easily understand the PCB manufacturing items and processes in the table, we also insert diagrams.

Items or processes
PCB Capabilities at PCBONLINE
Diagram
PCB layer quantity
1-80L
Finish PCB thickness
Max thickness
10mm
PCB thickness
Min thickness
0.12mm (2L)
0.18mm (4L)
Tolerance
Thickness≤1mm: ±0.1mm
Thickness>1mm: ±10%C
PCB thickness tolerance
Finished PCB length
Max length
1100mm
Min length
10mm
Finished PCB width
Max width
570mm
Min width
Relay VCC
Surface Finish
Sn thickness of HASL/LF-HASL
2-40um (0.4um on large Tin area of leaded HASL, 1.5um on large Tin area of lead-free HASL)
Min space between pads for HASL/LF-HASL PCB without solder mask
0.175mm (Pad space 0.25mm in large copper areas)
space between pads for HASL
OSP thickness
0.2-0.6um
ENIG thickness
Ni: 3-8um; Au: 0.05-0.1um
Cannot do 0.08um min gold
Min space between pads for ENIG PCB
0.08mm (base copper 1/3 oz, 0.5 oz)
space between pads for ENIG
Immersion Silver
0.15-0.4um
Immersion Tin
≥1.0um
Hard gold
0.1-4.0um
Soft gold
0.1-4.0um
ENEPIG
Ni: 3-8um, Pd: 0.05-0.15um, Au: 0.05-0.1um
Flash gold(electroplated gold)
Ni: ≥3um; Au: 0.025-0.1um; base copper≤1oz
Electroplated Gold finger
Ni:≥3um; Au: 0.25-1.5um (the thinnest point)
Min space between gold fingers
Dry film pattern plating 0.175mm; lead process 0.125mm
space between gold fingers
ENIG+Gold finger
Yes (need line)
Flash gold(electroplated gold)+Gold finger
Yes
Immersion silver+gold finger
Yes (need line)
Immersion tin+gold finger
Yes (need line)
Inner layer line width/space
1/2OZ Limit
Normal
3/3mil
inner layer line width
1OZ Limit
Normal
3/4mil
2OZ Limit
Normal
4/5mil
4/5.5mil
3OZ Limit
Normal
5/8mil
5/8mil
4OZ Limit
Normal
6/11mil
6.5/11mil
5OZ Limit
Normal
7/13.5mil
7/14mil
6OZ Limit
Normal
8/15mil
8/16mil
7OZ Limit
Normal
9/10mil
8OZ Limit
Normal
9/10mil
9OZ Limit
Normal
12/10mil
10OZ Limit
Normal
12/10mil
11OZ Limit
Normal
15/25mil
12OZ Limit
Normal
15/25mil
Tolerance
≤10mil: ±1.0mil, ±1mil
>10mil: ±1.5mil, ±20%
inner layer line width tolerance
Inner layer annular ring
1/2OZ
6.5mil
inner layer angular ring
1OZ
7mil
2OZ
7mil
3OZ
8mil
4OZ
8mil
5OZ
9mil
6OZ
NA
7OZ
NA
8OZ
NA
9OZ
NA
10OZ
NA
11OZ
NA
12OZ
NA
Inner layer grid
1/2OZ
8/8mil
inner layer grid
1OZ
10/10mil
2OZ
12/12mil
3OZ
Yes, not defined
4OZ
Yes, not defined
5OZ
Yes, not defined
6OZ
Yes, not defined
7OZ
NA
8OZ
NA
9OZ
NA
10OZ
NA
11OZ
NA
12OZ
NA
Min space between hole wall and conductor
Min space between hole wall and conductor (mechanical blind and buried vias and 2+2+2 laser buried and blind vias)
0.175mm (normal 0.2mm) for one-time laminating, 0.2mm (normal 0.225mm) for two times laminating, 0.225mm for three times laminating
space uhole wall and conductor
Min space between hole wall and conductor (None blind and buried vias and 1+N+1 laser blind via)
0.1375mm (normal 0.175mm) (≤8L), 0.1625mm (normal 0.2mm) (10-14L), 0.175mm (normal 0.2mm) (>14L)
space hole wall and conductor
Min space between laser holes and conductor (1+N+1 and 2+N+2 HDI PCB)
0.05mm (PTH PCB)
space laser hole wall and conductor
Min width of internally isolated strip
0.2mm
space between copper planes
Min inner layer core thickness
Relay VCC
inner layer core thickness
Lamination
Min isolation thickness between layers
0.05mm (just for base copper 0.5 oz)
isolation thickness between layers
Layer-to-layer registration tolerance (mm)
0.125mm (normal 0.15mm)
layer-to-layer registration tolerance
Hole
Finished mechanical hole size
0.1-6.1mm (corresponding drilling tool size 0.15-6.2mm)
Min. finished mechanical hole size
Min finished hole size for PTFE material and hybrid PTFE PCB
0.25mm
finished hole size for PTFE material and hybrid PTFE
Min connecting hole size
0.35mm (corresponding drilling tool size is 0.45mm)
connecting hole size
Min half-hole (PTH) size
0.3mm (corresponding drilling tool size is 0.4mm)
half hole size
Max aspect ratio for PTH hole
20: 1 (hole diameter>0.2mm)
aspect ratio for PTH hole
Min space between hole walls in different nets after compensation
0.25mm
space between hole walls in different nets
Min space between hole walls in the same net after compensation
0.15mm (PTH-hole & laser hole PCB), 0.25mm (Mechanical blind & buried hole PCB)
space between hole walls in the same net
Min space between NPTH hole walls
0.2mm
space between NPTH hole walls
Hole location tolerance (compared with CAD data)
±0.05mm
hole location tolerance
NPTH tolerance
±0.05mm (limit +0/-0.05mm or +0.05/-0mm)
npth tolerance
Pressfit hole tolerance
±0.05mm
+0.06/-0.04mm
pressfit hole tolerance
Countersink depth tolerance
±0.15mm
countersink depth tolerance
Countersink hole size tolerance
±0.15mm
countersink hole size tolerance
Countersink size and angle
PTH and NPTH, special: 82°, 90°, 120°, 135° (countersink drilling size 12-393.7mil)
countersink size and angle
PTH and NPTH, standard: angle130° (drilling size≤125mil), 165°(drilling size 125--248mil)
Countersink angle tolerance
±10°
countersink angle tolerance
Irregular slot tolerance (routing holes)
±0.1mm
normal ±0.125mm
irregular slot tolerance
Min tolerance for drilling slot
NPTH slot: Length/width≥2, width ±0.05mm, and length tolerance ±0.05mm; Length/width<2, width ±0.075mm, and length tolerance ±0.075mm
NPTH drilling slot tolerance
PTH slot: Length/width≥2, width ±0.075mm, and length tolerance ±0.075mm; Length/width<2,width ±0.075mm, and length tolerance ±0.1mm
PTH drilling slot tolerance
Min width of drill slot
0.45mm
Min. width of drill slot
Backdrilling
Drill hole size for backdrilling
0.5-6.2mm
drill hole size for backdrilling
Min. depth of backdrilling
0.2mm
depth of backdrilling
Insulation thickness between backdrilling layers (backdrilling target layer that must be cut & the next layer that must not cut
≥0.2mm
insulation thickness between backdrilling layers
Depth tolerance to backdrilling
±0.1mm
depth tolerance to backdrilling
Stub (Copper barrel that remains after backdrilling, measured from the must-not-cut layer)
Not defined
stub backdrilling
Pad (ring)
Min Pad size for laser drill
Hole diametrer D+0.15mm
pad size for laser drill
Min Pad size for mechanical drilling
Hole diametrer D+0.2mm
pad size for mechanical drill
Min BGA pad size
HASL: 0.25mm,
LF HASL: 0.3mm,
Other surface finishes: 0.175mm
BGA pad size
Pad size tolerance (BGA)
±0.03mm (pad size≤0.3mm);
±10% (pad size≥0.3mm)
BGA pad size tolerance
Outer layer line width/space
1/3OZ: Best
Normal
3.0/3.0mil
3.5/3.5mil
outer layer line space
1/2OZ: Best
Normal
3.5/3.6mil
4/4mil
1OZ: Best
Normal
4/4.5mil
5/5mil
2OZ: Best
Normal
5/6mil
7.5/8mil
3OZ: Best
Normal
6/7.5mil
9.5/10mil
4OZ: Best
Normal
14/12mil
14/14mil
5OZ: Best
Normal
18/17mil
18/18mil
6OZ: Best
Normal
20/24mil
22/26mil
7OZ: Best
Normal
22/26mil
24/28mil
8OZ: Best
Normal
Yes
9OZ: Best
Normal
Yes
10OZ: Best
Normal
Yes
11OZ: Best
Normal
Yes
>=12OZ: Limit
Normal
Yes
Width tolerance
±20%
(Impedance boards ±10%)
outer layer line width tolerance
Outer layer grid
1/3OZ
6/6mil
outer layer grid width
1/2OZ
6/6mil
1OZ
6.5/6mil
2OZ
10/11mil
3OZ
10/13mil
4OZ
12/16mil
5OZ
Yes
6OZ
Yes
7OZ
NA
8OZ
NA
9OZ
NA
10OZ
NA
11OZ
NA
12OZ
NA
Min space of SMD pads (requiring solder mask bridge) before compensation
1/3 OZ base copper
Not defined
Min. space of SMD pads
1/2 OZ base copper
Limit: 7.2mil (black sm: add 1.5mil, immersion tin: add 2mil, on ground copper area: add 4mil)
1 OZ base copper
Limit: 8mil (on ground copper area: add 4mil)
2 OZ base copper
Limit: 11mil (on ground copper area: add 2mil)
3 OZ base copper
Limit: 12mil (on ground copper area: add 2mil)
4 OZ base copper
Not defined
Position tolerance
Tolerance between pad and pad (Fiducial mark pad to Fiducial mark pad)
L≤300mm: ±0.1mm
L>300mm: ±0.125mm
tolerance between pad and pad
Tolerance between Hole and Hole
NA
tolerance between hole and hole
Tolerance between Pad center to Hole center
NA
tolerance between pad to hole
Via filling with resin for Via in PAD (POFV/ VIPPO)
Finished hole size for via filling with resin
0.1-0.9mm (drill size 0.15-1.0mm),
0.3-0.55mm normal (drill size 0.4-0.65mm)
hole size for via filling with resin
Max aspect ratio for via filling with resin PCB
12: 1
aspect ratio for via filling with resin
Min resin plugged PCB thickness
0.2mm
Min. resin plugged board thickness
Max via-filling-with-resin PCB thickness
3.2mm
Max via filling with resin board thickness
Can you make different hole sizes in one board?
Yes
different hole sizes in one PCB
Via filling with conductive copper paste/Silver paste
Via filling with conductive copper filling
Yes
via copper filling
Via filling with conductive silver filling
Yes
via silver filling
Peelable mask
Max hole size of peelable mask plugging
5mm
hole size of peelable mask plugging
The thickness of peelable mask
0.2-0.78mm
thickness of peelable mask
Min space between Peelable soldermask and pads
0.35mm
space between peelable soldermask and pads
Peelable solder mask larger than pad size (single-sided)
0.3mm
peelable solder mask larger than pad size
Carbon ink
Carbon ink thickness
10-50um
carbon ink thickness
Min gap between carbon pads
0.325mm
gap between carbon and pads
Carbon ink with resistance control
NA
Min gap between carbon and pads
0.2mm
gap between carbon and pads.webp
Solder mask
Max finished hole size for solder mask full-plugging (both sides without solder mask opening)
0.8mm
hole size for solder mask full plugging
Max finished hole size for solder mask half-pugging (one side with solder mask opening, the other side without)
0.45mm
hole size for solder mask half pugging
Solder mask color
Green matte/glossy, yellow, black, blue, red, white
Solder mask thickness
10-18um (on copper area),
5-7um (on via pad),
≥5um (on circuits around the corner, just for one-time print and copper thickness<48um)
solder mask thickness
Min width of soldermask cover line single side
2.5mil (partial area can be allowed 1.5mil)
width of solder mask cover line single side
Min width of solder mask bridge
a. Base copper≤0.5 oz: Immersion Tin: 7.5mil (black), 5.5mil (other color); other surface treatment: 5.5 mil (black,extremity 5mil), 4mil (other color,extremity 3.5mil)
b. Base coppe 1 oz: 4mil (green), 5mil (other color), 5.5mil (black, extremity 5mil)
c. Base copper 1.43 oz: 4mil (green), 5.5mil (other color), 6mil (black)
d. Base copper 2 oz-4 oz: 6mil
width of solder mask bridge
Silkscreen color
White, yellow, black
Silkscreen thickness
Not defined
silkscreen thickness
Min gap between Legend and Pad
6mil (PTH & laser hole PCB),10mil (mechanical blind & buried PCB)
gap between legend and pad
Silkscreen print type (only for white color)
Serial number, barcode, planar code
QR code scan
By Printer

Now you've learned about all the rigid PCB capabilities of PCBONLINE. Besides rigid PCBs, PCBONLINE also provides flexible PCBs and rigid-flex PCBs, and we will publish the other two blog pages for you to fully understand what PCBONLINE can do in PCB manufacturing.

If you find PCBONLINE matches your project manufacturing demands, don't hesitate to email info@pcbonline.com to get a quote.

© This article is an original work of the PCBONLINE team. Please indicate the author PCBONLINE if you reprint. If the article is reproduced without permission or indicating the author's source, PCBONLINE reserves the right to investigate the infringement.
View and save our product information
PCB fabrication at PCBONLINE.pdf

GET A FREE QUOTE

File Upload
instagram_img