Rigid PCB Capabilities at PCBONLINE in 2024 [FR4, MCPCB, etc]

PCBONLINE is a one-stop advanced PCB manufacturers for middle and high-end applications. As our PCB fabrication page can't display all the PCB capabilities, we share all of our PCB manufacturing capabilities for rigid PCBs, flexible PCBs, and rigid-flex PCBs in the blogs.

This page shows the rigid PCB capabilities, including FR4 PCBs, metal-core PCBs, PTFE/high-frequency PCBs, HDI PCBs, and special material PCBs.

If you find that PCBONLINE's rigid PCB capabilities match your project requirements, please do not hesitate to contact us via the online chat window.

You can see PCBONLINE's rigid PCB capabilities below. For you to easily understand the PCB manufacturing items and processes in the table, we also insert diagrams.

Items or processes		PCB Capabilities at PCBONLINE	Diagram
PCB layer quantity		1-80L
Finish PCB thickness	Max thickness	10mm
	Min thickness	0.12mm (2L) 0.18mm (4L)
	Tolerance	Thickness≤1mm: ±0.1mm Thickness＞1mm: ±10%C
Finished PCB length	Max length	1100mm
	Min length	10mm
Finished PCB width	Max width	570mm
	Min width	Relay VCC
Surface Finish	Sn thickness of HASL/LF-HASL	2-40um (0.4um on large Tin area of leaded HASL, 1.5um on large Tin area of lead-free HASL)
	Min space between pads for HASL/LF-HASL PCB without solder mask	0.175mm (Pad space 0.25mm in large copper areas)
	OSP thickness	0.2-0.6um
	ENIG thickness	Ni: 3-8um; Au: 0.05-0.1um Cannot do 0.08um min gold
	Min space between pads for ENIG PCB	0.08mm (base copper 1/3 oz, 0.5 oz)
	Immersion Silver	0.15-0.4um
	Immersion Tin	≥1.0um
	Hard gold	0.1-4.0um
	Soft gold	0.1-4.0um
	ENEPIG	Ni: 3-8um, Pd: 0.05-0.15um, Au: 0.05-0.1um
	Flash gold(electroplated gold)	Ni: ≥3um; Au: 0.025-0.1um; base copper≤1oz
	Electroplated Gold finger	Ni:≥3um; Au: 0.25-1.5um (the thinnest point)
	Min space between gold fingers	Dry film pattern plating 0.175mm; lead process 0.125mm
	ENIG+Gold finger	Yes (need line)
	Flash gold(electroplated gold)+Gold finger	Yes
	Immersion silver+gold finger	Yes (need line)
	Immersion tin+gold finger	Yes (need line)
Inner layer line width/space	1/2OZ Limit Normal	3/3mil
	1OZ Limit Normal	3/4mil
	2OZ Limit Normal	4/5mil 4/5.5mil
	3OZ Limit Normal	5/8mil 5/8mil
	4OZ Limit Normal	6/11mil 6.5/11mil
	5OZ Limit Normal	7/13.5mil 7/14mil
	6OZ Limit Normal	8/15mil 8/16mil
	7OZ Limit Normal	9/10mil
	8OZ Limit Normal	9/10mil
	9OZ Limit Normal	12/10mil
	10OZ Limit Normal	12/10mil
	11OZ Limit Normal	15/25mil
	12OZ Limit Normal	15/25mil
	Tolerance	≤10mil: ±1.0mil, ±1mil ＞10mil: ±1.5mil, ±20%
Inner layer annular ring	1/2OZ	6.5mil
	1OZ	7mil
	2OZ	7mil
	3OZ	8mil
	4OZ	8mil
	5OZ	9mil
	6OZ	NA
	7OZ	NA
	8OZ	NA
	9OZ	NA
	10OZ	NA
	11OZ	NA
	12OZ	NA
Inner layer grid	1/2OZ	8/8mil
	1OZ	10/10mil
	2OZ	12/12mil
	3OZ	Yes, not defined
	4OZ	Yes, not defined
	5OZ	Yes, not defined
	6OZ	Yes, not defined
	7OZ	NA
	8OZ	NA
	9OZ	NA
	10OZ	NA
	11OZ	NA
	12OZ	NA
Min space between hole wall and conductor	Min space between hole wall and conductor (mechanical blind and buried vias and 2+2+2 laser buried and blind vias)	0.175mm (normal 0.2mm) for one-time laminating, 0.2mm (normal 0.225mm) for two times laminating, 0.225mm for three times laminating
	Min space between hole wall and conductor (None blind and buried vias and 1+N+1 laser blind via)	0.1375mm (normal 0.175mm) (≤8L), 0.1625mm (normal 0.2mm) (10-14L), 0.175mm (normal 0.2mm) (＞14L)
	Min space between laser holes and conductor (1+N+1 and 2+N+2 HDI PCB)	0.05mm (PTH PCB)
	Min width of internally isolated strip	0.2mm
	Min inner layer core thickness	Relay VCC
Lamination	Min isolation thickness between layers	0.05mm (just for base copper 0.5 oz)
	Layer-to-layer registration tolerance (mm)	0.125mm (normal 0.15mm)
Hole	Finished mechanical hole size	0.1-6.1mm (corresponding drilling tool size 0.15-6.2mm)
	Min finished hole size for PTFE material and hybrid PTFE PCB	0.25mm
	Min connecting hole size	0.35mm (corresponding drilling tool size is 0.45mm)
	Min half-hole (PTH) size	0.3mm (corresponding drilling tool size is 0.4mm)
	Max aspect ratio for PTH hole	20: 1 (hole diameter＞0.2mm）
	Min space between hole walls in different nets after compensation	0.25mm
	Min space between hole walls in the same net after compensation	0.15mm (PTH-hole & laser hole PCB), 0.25mm (Mechanical blind & buried hole PCB)
	Min space between NPTH hole walls	0.2mm
	Hole location tolerance (compared with CAD data)	±0.05mm
	NPTH tolerance	±0.05mm (limit +0/-0.05mm or +0.05/-0mm)
	Pressfit hole tolerance	±0.05mm +0.06/-0.04mm
	Countersink depth tolerance	±0.15mm
	Countersink hole size tolerance	±0.15mm
	Countersink size and angle	PTH and NPTH, special: 82°, 90°, 120°, 135° (countersink drilling size 12-393.7mil)
		PTH and NPTH, standard: angle130° (drilling size≤125mil), 165°(drilling size 125--248mil)
	Countersink angle tolerance	±10°
	Irregular slot tolerance (routing holes)	±0.1mm normal ±0.125mm
	Min tolerance for drilling slot	NPTH slot: Length/width≥2, width ±0.05mm, and length tolerance ±0.05mm; Length/width＜2, width ±0.075mm, and length tolerance ±0.075mm
		PTH slot: Length/width≥2, width ±0.075mm, and length tolerance ±0.075mm; Length/width＜2,width ±0.075mm, and length tolerance ±0.1mm
	Min width of drill slot	0.45mm
Backdrilling	Drill hole size for backdrilling	0.5-6.2mm
	Min. depth of backdrilling	0.2mm
	Insulation thickness between backdrilling layers (backdrilling target layer that must be cut & the next layer that must not cut	≥0.2mm
	Depth tolerance to backdrilling	±0.1mm
	Stub (Copper barrel that remains after backdrilling, measured from the must-not-cut layer)	Not defined
Pad (ring)	Min Pad size for laser drill	Hole diametrer D+0.15mm
	Min Pad size for mechanical drilling	Hole diametrer D+0.2mm
	Min BGA pad size	HASL: 0.25mm, LF HASL: 0.3mm, Other surface finishes: 0.175mm
	Pad size tolerance (BGA)	±0.03mm (pad size≤0.3mm); ±10% (pad size≥0.3mm)
Outer layer line width/space	1/3OZ: Best Normal	3.0/3.0mil 3.5/3.5mil
	1/2OZ: Best Normal	3.5/3.6mil 4/4mil
	1OZ: Best Normal	4/4.5mil 5/5mil
	2OZ: Best Normal	5/6mil 7.5/8mil
	3OZ: Best Normal	6/7.5mil 9.5/10mil
	4OZ: Best Normal	14/12mil 14/14mil
	5OZ: Best Normal	18/17mil 18/18mil
	6OZ: Best Normal	20/24mil 22/26mil
	7OZ: Best Normal	22/26mil 24/28mil
	8OZ: Best Normal	Yes
	9OZ: Best Normal	Yes
	10OZ: Best Normal	Yes
	11OZ: Best Normal	Yes
	>=12OZ: Limit Normal	Yes
	Width tolerance	±20% (Impedance boards ±10%)
Outer layer grid	1/3OZ	6/6mil
	1/2OZ	6/6mil
	1OZ	6.5/6mil
	2OZ	10/11mil
	3OZ	10/13mil
	4OZ	12/16mil
	5OZ	Yes
	6OZ	Yes
	7OZ	NA
	8OZ	NA
	9OZ	NA
	10OZ	NA
	11OZ	NA
	12OZ	NA
Min space of SMD pads (requiring solder mask bridge) before compensation	1/3 OZ base copper	Not defined
	1/2 OZ base copper	Limit: 7.2mil (black sm: add 1.5mil, immersion tin: add 2mil, on ground copper area: add 4mil)
	1 OZ base copper	Limit: 8mil (on ground copper area: add 4mil)
	2 OZ base copper	Limit: 11mil (on ground copper area: add 2mil)
	3 OZ base copper	Limit: 12mil (on ground copper area: add 2mil)
	4 OZ base copper	Not defined
Position tolerance	Tolerance between pad and pad (Fiducial mark pad to Fiducial mark pad)	L≤300mm: ±0.1mm L＞300mm: ±0.125mm
	Tolerance between Hole and Hole	NA
	Tolerance between Pad center to Hole center	NA
Via filling with resin for Via in PAD (POFV/ VIPPO)	Finished hole size for via filling with resin	0.1-0.9mm (drill size 0.15-1.0mm), 0.3-0.55mm normal (drill size 0.4-0.65mm)
	Max aspect ratio for via filling with resin PCB	12: 1
	Min resin plugged PCB thickness	0.2mm
	Max via-filling-with-resin PCB thickness	3.2mm
	Can you make different hole sizes in one board?	Yes
Via filling with conductive copper paste/Silver paste	Via filling with conductive copper filling	Yes
	Via filling with conductive silver filling	Yes
Peelable mask	Max hole size of peelable mask plugging	5mm
	The thickness of peelable mask	0.2-0.78mm
	Min space between Peelable soldermask and pads	0.35mm
	Peelable solder mask larger than pad size (single-sided)	0.3mm
Carbon ink	Carbon ink thickness	10-50um
	Min gap between carbon pads	0.325mm
	Carbon ink with resistance control	NA
	Min gap between carbon and pads	0.2mm
Solder mask	Max finished hole size for solder mask full-plugging (both sides without solder mask opening)	0.8mm
	Max finished hole size for solder mask half-pugging (one side with solder mask opening, the other side without)	0.45mm
	Solder mask color	Green matte/glossy, yellow, black, blue, red, white
	Solder mask thickness	10-18um (on copper area), 5-7um (on via pad), ≥5um (on circuits around the corner, just for one-time print and copper thickness<48um)
	Min width of soldermask cover line single side	2.5mil (partial area can be allowed 1.5mil)
	Min width of solder mask bridge	a. Base copper≤0.5 oz: Immersion Tin: 7.5mil (black), 5.5mil (other color); other surface treatment: 5.5 mil (black,extremity 5mil), 4mil (other color,extremity 3.5mil) b. Base coppe 1 oz: 4mil (green), 5mil (other color), 5.5mil (black, extremity 5mil) c. Base copper 1.43 oz: 4mil (green), 5.5mil (other color), 6mil (black) d. Base copper 2 oz-4 oz: 6mil
	Silkscreen color	White, yellow, black
	Silkscreen thickness	Not defined
	Min gap between Legend and Pad	6mil (PTH & laser hole PCB),10mil (mechanical blind & buried PCB)
	Silkscreen print type (only for white color)	Serial number, barcode, planar code
	QR code scan	By Printer

Now you've learned about all the rigid PCB capabilities of PCBONLINE. Besides rigid PCBs, PCBONLINE also provides flexible PCBs and rigid-flex PCBs, and we will publish the other two blog pages for you to fully understand what PCBONLINE can do in PCB manufacturing.

If you find PCBONLINE matches your project manufacturing demands, don't hesitate to email info@pcbonline.com to get a quote.