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PCBONLINE Manufacturing Capabilities: PCB/Assembly in 2021

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Tues, May 25, 2021

PCBONLINE is an advanced PCB manufacturer founded in 1999. Over the 22 years, we had built three PCB and PCBA manufacturing bases - one PCB factory in Jiangxi, one PCB factory in Jiangsu, and one PCB assembly factory in Shenzhen. All levels of production, from prototypes to large-scale manufacturing, happen on the same production lines. You may be curious - what are the manufacturing capabilities of PCBONLINE?

pcb manufacturing

First, let's look into the PCB manufacturing capability. We focus on high-end PCBs, such as the flexible (FPC), rigid-flex PCB, HDI, etc. And below is our capabilities:

PCB Technical Capacity

We classify the printed circuit boards into the HDI board and plated through-hole boards. Here are our PCB manufacturing capabilities.

Technical Capabilities
Plated Though-Hole Boards
Maximum Layers
24
24
HDI Stackup
3+N+3
/
Max. Processing Board Size
24.5" × 28.5" (620 × 720mm)
24.5" × 37.5" (620mm × 950mm)
Min. Line Width/Line Space
I/L: 2.5mil/2.5mil O/L: 4mil/4mil (POFV)
I/L: 2.5mil/2.5mil O/L: 4mil/4mil(POFV)
Board Thickness
3.5mm
4.0mm
Min. Drill Bit
6mil
6mil
Aspect Ratio
18:01
18:01
Min. Micro Via & Aspect Ratio
4mil & 0.8:1
/
Min Core Board Thickness
2mil
2mil
Alignment between Layers
5mil
5mil
Solder Mask Tolerance
±8%
±8%
Back Drill stub
2-10mil
2-10mil
Copper Fill
Yes
/
POFV
Yes
Yes
Skip-via (L1-3)
No
No
Buried Copper Block
Yes
Yes
Buried Capacitance
No
No

Please note that plated through-hole PCBs in our chart include many types of PCBs, such as high-frequency, ceramic, thick-copper, high-TG, halogen-free, etc. I will add the specific specifications charts of these advanced boards to this post when I am done. Let's see PCBONLINE's capabilities of flexible PCB (FPC) and rigid-flex PCB.

FPC and Rigid-Flex PCB Capabilities

Technical Capabilities
Maximum Layers
6
10
Min. Mechanical Drilling Hole Diameter
0.1mm
0.15mm
Min. Laser Blind Hole Aperture
0.075mm
0.1mm
Max. Blind Hole Aspect Ratio
0.8
1
Blind Hole Buried Copper
No
Yes
Min. Through-Hole Pad
0.3mm
0.35mm
Min. Blind Hole Capture/Login Pad
0.275mm
0.25mm
Minimum Line Width/Line Space
0.035/0.035mm
0.065/0.065mm (rigid board layer)
Min. Interlayer Alignment
±0.05mm
±0.05mm
Min. Hard Board Dielectric Layer Thickness
±0.05mm
±0.05mm
Surface Finishes
ENIG, OSP, ENEPIG, Immersion Tin
Applications
display module, smartphone, camera module, consumer electronics

PCBONLINE's target customers are senior engineers and electronic solutions companies. If you are looking for a long-term PCB manufacturer for your devices, contact us by email at info@pcbonline.com.

PCB Assembly Capabilities

PCBONLINE has mature SMT, THT, DIP lines for advanced PCB assembly. Our one-to-one engineering support, BOM and component inspection, and first piece test will make sure the assembly's success.

The below image shows the functional mounting machine we use in our assembly factory. Functional mounting machines are used to mount components of big sizes, such as BGA, FPGA, etc. Its capabilities can stand for part of our assembly capabilities:

pcb-assembly-machine.jpg

Specifications
Values
Placement Accuracy
±0.035mm (Cpk≥1)
Placement Speed
42,000CPH
Feeder Inputs
Max. 112
Min. Board Size
50mm * 50mm
Max. Board Size
1,200mm * 370mm
Max. Rectangular Part Size
50mm * 150mm
Max. Square Part Size
74mm * 74mm
Max. Component Height
25mm
PCB Thickness
0.3mm - 4.0mm
Min. Component Size
0201mm

No matter what the circuit board quantity is, our manufacturing standards and procedures are the same. We never reduce PCB quality. Our strong manufacturing capabilities can meet all your requirements. If you have not been worked with PCBONLINE, welcome to get a quote online or contact us. Our circuit board quality will meet and exceed your expectations.