NVIDA VS AMD GPU

The graphics card market of 2025 is undergoing a profound transformation due to the head-on collision between NVIDIA's Blackwell architecture and AMD's RDNA 4 architecture. This isn't just a simple race for frame rates; it's a comprehensive technological battle centered around AI computing power, energy efficiency, and ecosystem integration. NVIDIA, leveraging its leading edge in AI acceleration and DLSS 4.0 technology, is committed to providing the ultimate experience for gamers and professional creators; AMD, on the other hand, offers a highly competitive and cost-effective option through its revolutionary ray tracing performance and open FSR 4.0 ecosystem. This article will delve into the core differences between the two companies in terms of architectural design, graphics memory technology, AI acceleration, and software ecosystems, helping you find the best solution for your needs in this technological battle.

Architecture Evolution and Performance Breakthroughs

The GPU market in 2025 is undergoing unprecedented technological iteration and market restructuring. NVIDIA's RTX 50 series, based on the Blackwell architecture, and AMD's RX 9000 series, based on the RDNA 4 architecture, are facing off head-on. This battle not only reshapes the performance boundaries of consumer graphics cards but also intensifies competition in AI computing power, energy efficiency, and ecosystem integration. This technological competition is driven by the dual forces of stratified consumer demand and a revolution in industrial computing power.

NVIDIA, leveraging its Blackwell architecture, pioneered the introduction of GDDR7 video memory and the PCIe 5.0 interface into the mainstream market. For example, the RTX 5070 Ti features a GB203 core built on TSMC's 4N process, 8,960 CUDA cores, 16GB of GDDR7 memory, and a memory bandwidth of 896GB/s, a 40% increase over the previous-generation RTX 4070 Ti. More importantly, the fifth-generation Tensor Core boasts over 798 TOPS of AI computing power. Combined with DLSS 4.0 multi-frame generation technology, it doubles the frame rate at 4K resolution in "Black Myth: Wukong," while reducing detail loss to less than 5%.

AMD, on the other hand, leverages its RDNA 4 architecture and TSMC's 4nm process technology to establish a technological advantage. The RX 9070 XT boasts a core frequency exceeding 3.2GHz, a 22% increase in rasterization performance over the RX 7900 XTX, and an 18% reduction in power consumption at 1440p. Its proprietary FidelityFX Super Resolution 4 technology, powered by AI-powered anti-aliasing algorithms, achieves image quality comparable to DLSS 4.0 in "Cyberpunk 2077," while offering compatibility with over 90% of graphics cards released after 2018.

Core Technology Differences

Architecture Design and Process

NVIDIA's Blackwell architecture represents a paradigm shift in GPU design. Its greatest innovation lies in the physical reconstruction of chip design, achieving scalable performance improvements through a dual-chip modular design. The RTX 5090 boasts 21,760 CUDA cores and utilizes TSMC's 4N process. Its 575W TDP makes it a performance monster, yet it still offers significant improvements in energy efficiency over the previous generation.

AMD's RDNA 4 architecture focuses on unified compute units and enhanced AI capabilities. RDNA 4 introduces third-generation RT accelerators, delivering twice the ray tracing throughput of RDNA 3. Each compute unit boasts a 40% performance increase over RDNA 3, achieved through instruction-level parallelism optimizations and cache hierarchy restructuring. Notably, the RDNA 4 architecture supports DisplayPort 2.1a and HDMI 2.1b, supporting resolutions up to 8K at 144Hz with 12-bit HDR, putting it on par with high-end products from NVIDIA and Intel in terms of display technology.

Video Memory Technology Route

NVIDIA: Shifting entirely to GDDR7 video memory, achieving 1792GB/s bandwidth with a 28Gbps rate and 512-bit bit width, but the cost is 40% higher than GDDR6X.

AMD: Adopting a "dual-track strategy"—mainstream RX 9000 series models use GDDR6X, while flagship models feature HBM3E. This strategy results in a 22% higher BOM cost for the RX 9090 XTX than the RTX 5090, hindering its pricing strategy.

AI Acceleration and Super-resolution Technology

NVIDIA's DLSS 4.0 implements multi-frame generation technology, making gaming smoother and lag-free. DLSS 4.0 doubled the frame rate in "Black Myth: Wukong" at 4K resolution, while reducing detail loss to less than 5%. The fifth-generation Tensor Cores boast over 798 TOPS of AI computing power, delivering not only exceptional gaming performance but also a 127% improvement in single-GPU generation efficiency compared to the RTX 4090 in Stable Diffusion XL model training.

AMD's FSR 4.0, using AI-powered anti-aliasing algorithms, achieves comparable image quality to DLSS 4.0 in "Cyberpunk 2077." FSR 4.0 improves temporal stability, detail reconstruction, and reduces ghosting and artifacts. AMD's greatest advantage lies in its hardware compatibility—FSR 4.0 covers over 90% of graphics cards released after 2018.

Software and Ecosystem Construction: The Protracted Battle Between CUDA and ROCm

Driver and Software Support

NVIDIA's Studio drivers support over 700 creative applications, forming a robust creative ecosystem. GeForce Experience offers convenient game optimization, recording, and live streaming features, providing a mature and stable user experience. NVIDIA's fast and stable driver update cadence has long been an industry benchmark.

AMD has made significant progress in driver stability in recent years, and its Adrenalin software interface is renowned for its rich functionality and ease of use. However, a gap remains in professional application optimization. While AMD Radeon Pro Render's rendering speed in Blender matches OctaneRender's, it still lags 30% behind in Adobe's full suite of graphics cards. This ecosystem gap is directly reflected in market share. Steam's April hardware survey shows that the RTX 4060 laptop graphics card market share reached 4.99%, while AMD's mobile graphics card market share is less than 8%.

AI Development Ecosystem Comparison

In the field of AI development, NVIDIA has established a near-monopoly with its CUDA ecosystem:

NVIDIA: The CUDA ecosystem is the industry standard in fields such as AI, scientific research, video editing, and 3D rendering. Its extensive library, framework support, and development tools have created a powerful network effect, making NVIDIA difficult to replace in professional fields.

AMD: It is building out its open software stack for computing and AI, ROCm, including AITER (a tensor engine optimized for AI operations) and GPUOperator (which simplifies Kubernetes deployment). AMD recognizes that a strong ecosystem—tools, libraries, and frameworks—is crucial for competing in the AI ​​field.

AMD's "Advancing AI" event on June 12, 2025, is expected to reveal more about the development of its AI ecosystem. However, as things stand, AMD still has some catching up to do in its AI development ecosystem.

In short, the GPU market in 2025 is vibrant due to the fierce competition between NVIDIA and AMD. NVIDIA, with its powerful Blackwell architecture, leading AI computing power, and mature CUDA ecosystem, continues to set the benchmark in high-end gaming and professional fields. Meanwhile, AMD, with its RDNA 4 architecture, offers significant leaps in ray tracing and energy efficiency, as well as the broad compatibility of its FSR technology, providing a compelling value proposition. The ultimate winner in this technological battle is undoubtedly the consumer—from gamers seeking the ultimate experience to content creators and AI developers demanding powerful computing power, consumers now have unprecedented freedom to choose the graphics solution that best suits them.

One-Stop HDI PCB Manufacturer and Its PCB Via Filing Capabilities

If you're looking for turnkey HDI electronics manufacturing services (EMS) from hardware development to PCBA fabrication and box-build assembly, you can work with the one-stop HDI PCBA manufacturer PCBONLINE.

Founded in 1999, PCBONLINE has R&D capabilities for HDI projects and EMS manufacturing capabilities, including via filling for stacked vias. It provides 4-to-64-layer HDI PCB fabrication, assembly, and PCBA box-build assembly. You can order various HDI PCBs from PCBONLINE, such as FR4, polyimide (flexible PCB), polyimide + FR4 (rigid-flex PCB), and PTFE/Rogers (high-frequency PCB).

Here'e the PCB via filing capabilities at PCBONLINEL:

• Micriavia filling with copper: laser via size 0.1-0.125mm, priority 0.1mm
• Finished hole size for via-in-pad filling with resin: 0.1-0.9mm (drill size 0.15-1.0mm), 0.3-0.55mm normal (drill size 0.4-0.65mm)
• Max aspect ratio for via-in-pad filling with resin PCB - 12: 1
• Min resin plugged PCB thickness: 0.2mm
• Max via-filling ith resin PCB thickness: 3.2mm
• Making different hole sizes with via filling in one board: Yes
• Via filling with copper/silver: Yes

If you need HDI PCBAs or any other PCBAs requiring via filling, please send your email to PCBONLINE at info@pcbonline.com. We will provide one-on-one engineering support to you.

Conclusion

Via filling is used for creating stacked vias in HDI PCB fabrication, BGA/CSP/QFN IC packaging, and filling PCB via-in-pad with resin during multilayer PCB fabrication. If you need one-stop electronics manufacturing for your HDI PCBA project, contact the one-stop advanced PCB manufacturer PCBONLINE for high-quality PCBA and box-build solutions tailored to your project's needs.