Home> Blog> Engineering for Harsh Realities

Engineering for Harsh Realities

PCB
PCBONLINE Team Fri, Nov 21, 2025
19

Industrial control systems operate in a world far removed from consumer electronics. Their core challenge is achieving High Reliability and Long Service Life in Extreme Environments. This blog explores the critical engineering hurdles involved, from surviving harsh temperatures and EMI to ensuring real-time software performance and rigorous certification.


High Reliability and Long Service Life in Extreme Environments

This represents the most critical challenge in industrial control, fundamentally distinguishing it from consumer electronics.

Wide Temperature Operation: Equipment must function stably across a temperature range of -40°C to +85°C (or even wider). This involves:

  • Component Selection: Standard commercial-grade components are inadequate; industrial-grade or military-grade alternatives must be used, incurring significant costs.

  • Thermal Design: How to dissipate heat? Maintain performance at high temperatures? Prevent condensation and startup issues at low temperatures?

  • Material Aging: PCB substrates, connectors, cable jackets, etc., are prone to aging and brittleness under thermal cycling.
  • /br>

    Harsh Environment Tolerance:

  • Vibration and Shock: Equipment mounted on machine tools or production lines endures continuous vibration, potentially causing solder joint failure, screw loosening, or connector detachment.

  • Dust and Moisture: Requires high-grade dustproof (IP5X) and waterproof (IPX7/8) designs, demanding exceptional enclosure sealing and interface processing techniques.

  • Electromagnetic Interference: Factory environments are saturated with strong EMI generated by inverters, high-power motors, radio equipment, etc. Products must pass rigorous EMC (Electromagnetic Compatibility) testing to ensure immunity to interference (immunity) and minimal emission of interference (emissions).

  • Long Lifespan and Stability: Industrial equipment has lifecycles spanning 10-20 years. This necessitates:

  • Supply Chain Stability: Critical components must remain available for procurement a decade later, or alternative spare parts solutions must be established.

  • Software Maintenance: Long-term security support and updates for operating systems and underlying drivers.
  • The core challenge in manufacturing industrial control products lies in achieving high reliability and long service life under extreme environmental conditions. Products must operate stably for decades under harsh conditions including extreme temperature fluctuations, continuous vibration, dust and humidity, and intense electromagnetic interference. This demands that every aspect—from component selection (requiring industrial-grade or military-grade parts), thermal design, protection ratings (such as IP ratings), to electromagnetic compatibility (EMC) design—far exceeds consumer electronics standards. It also poses severe challenges regarding material aging and long-term supply chain stability.

    EMC

    Complexity of Hardware Design and Manufacturing

    Signal Integrity: Control systems simultaneously incorporate analog signals (e.g., sensor inputs), digital signals (e.g., I/O signals), and high-speed communication buses (e.g., EtherCAT, Profinet). Preventing digital signals from interfering with sensitive analog signals while ensuring stable transmission over high-speed buses poses significant challenges for PCB layout and routing.

    Power Integrity: Providing clean, stable power to CPUs, FPGAs, and various interfaces is fundamental to system stability. Improper power design can cause random system crashes or resets, with issues being elusive and difficult to debug.

    Mixed-Signal Processing: Requires precise acquisition of weak analog signals (e.g., mV signals from thermocouples) and output of high-precision analog control signals (e.g., current to control servo valves). This imposes extremely high demands on ADC/DAC accuracy, reference source stability, and anti-interference design of analog circuits.

    Protection Circuit Design: Industrial environments frequently involve risks like surges, overvoltage, reverse connections, and short circuits. Each external interface (power, communication, I/O) requires complex protection circuits (TVS, fuses, PTC, etc.), increasing board footprint and cost.

    The complexity of hardware manufacturing lies in handling mixed signals and ensuring system robustness. High-speed digital signals, weak analog signals, and high-power power supplies coexist on the circuit board, requiring designers to overcome signal integrity and power integrity challenges. Simultaneously, each external interface must incorporate precise reverse polarity, surge, overvoltage, and short-circuit protection circuits to guard against common electrical hazards in industrial environments. This significantly increases the complexity and cost of PCB layout routing, component selection, and protective manufacturing processes.

    The following diagram illustrates a control circuit for motor overheat protection, consisting of PTC thermistors and a Schmitt trigger circuit. In the diagram, RT1, RT2, and RT3 are three step-type PTC thermistors with identical characteristics, each embedded within the motor stator windings. Under normal conditions, the PTC thermistors remain at ambient temperature, with their combined resistance value below 1 kΩ. At this time, V1 is cutoff, V2 is conducting, and relay K is energized to close its normally open contact, allowing the motor to operate on mains power.

    When localized overheating occurs due to a fault, if any single PTC thermistor exceeds the preset temperature, its resistance will rise above 10KΩ. Consequently, V1 conducts, V2 is cutoff, VD2 displays a red alarm, K de-energizes and releases, and the motor stops running, achieving the protective function.

    Circuit-Protection-Design

    Real-Time and Deterministic Properties of Software and Firmware

  • Real-Time Performance: Industrial control demands that commands receive responses within defined timeframes. For instance, an emergency stop signal must be processed within milliseconds or even microseconds. This requires:
  • Real-Time Operating Systems: Utilizing VxWorks, QNX, RT-Linux, or specialized real-time kernels.

    Hard Real-Time vs. Soft Real-Time: Imposing stringent metrics on task scheduling and interrupt response times.

  • Determinism: Regardless of system load, control loop execution cycles must be fixed and predictable. This is critical in multi-axis motion control.

  • Functional Safety: For systems involving personal safety (e.g., safety relays, safety PLCs), compliance with standards like IEC 61508 and ISO 13849, incorporating redundancy, self-diagnostics, and safe failure modes. Rigorous processes govern everything from chip selection and circuit design to code implementation.

  • Compatibility and Interoperability: Support for multiple industrial communication protocols (Profinet, EtherCAT, Modbus TCP/RTU, etc.) is essential, ensuring stable communication with devices from different manufacturers. Implementing and testing protocol stacks is highly complex.
  • The core challenge at the software level is meeting real-time and deterministic requirements. Industrial control demands that system responses to commands occur within milliseconds or microseconds, with stable and predictable cycles. This relies on real-time operating systems (RTOS) and meticulous task scheduling. Additionally, the software must achieve interoperability across multiple industrial communication protocols. For functions involving personal safety, it must adhere to stringent functional safety standards (such as IEC 61508), incorporating redundancy, self-diagnostics, and safe failure mechanisms.

    Stringent Testing and Certification Requirements

  • Comprehensive Environmental Testing: Includes high/low temperature cycling, humidity/heat testing, vibration testing, shock testing, etc., characterized by lengthy cycles and significant equipment investment.

  • Rigorous EMC Testing: Requires a series of tests including radiated emissions, conducted emissions, electrostatic discharge, surge, and burst immunity. Failure in any single test may necessitate product design rework.

  • Safety Standard Certifications: Products must obtain safety certifications for target markets, such as UL and CE (covering EMC and LVD directives), involving complex procedures and high costs.

  • Long-Term Aging Tests: Prior to shipment, products undergo extended power-on aging tests to identify components prone to early failure, ensuring the reliability of delivered products.

  • Rigorous and comprehensive testing and certification serve as the final gatekeeper ensuring product compliance. The manufacturing process involves a series of lengthy environmental tests (temperature cycling, vibration, humidity and heat), electromagnetic compatibility (EMC) testing, and safety standard certifications (such as UL, CE). Failure in any single test may necessitate design rework. Long-term aging tests are also conducted prior to shipment to screen out products prone to early failures. This entire process demands significant investment and a lengthy timeline, forming a critical barrier before product launch.

    EMC-test

    Supply Chain and Production Management

  • Component Quality Grading: Establish a reliable industrial-grade/automotive-grade component supply chain and enforce rigorous incoming material inspections.

  • Production Process Control: Demands extremely high precision in processes such as soldering quality (especially for BGA chips), conformal coating application, and sealed assembly, requiring sophisticated SMT equipment and strict process specifications.

  • Small Batches, High Variety: Industrial control products often feature numerous models, but individual model production volumes may be low, posing challenges for flexible production line management.

  • Cost Control: Maintaining competitiveness requires balancing high performance and reliability demands with cost containment—a persistent balancing act.

  • In supply chain and production management, the challenge lies in balancing high quality with small batch sizes. It is essential to establish a reliable industrial-grade component supply chain with rigorous quality inspections, while production processes must incorporate high-precision techniques (such as BGA soldering and conformal coating application) to ensure consistency. However, industrial control products typically feature numerous variants and low production volumes. This characteristic demands production lines with highly flexible management capabilities, requiring continuous cost control while maintaining extremely high reliability—a formidable challenge.

    In summary, creating industrial control products is a discipline of extreme engineering. It demands an uncompromising focus on reliability at every stage—from robust hardware design and deterministic software to stringent testing. This relentless pursuit of stability and longevity in the face of extreme conditions is what truly distinguishes industrial technology.

    One-Stop HDI PCB Manufacturer and Its PCB Via Filing Capabilities

    If you're looking for turnkey HDI electronics manufacturing services (EMS) from hardware development to PCBA fabrication and box-build assembly, you can work with the one-stop HDI PCBA manufacturer PCBONLINE.

    Founded in 1999, PCBONLINE has R&D capabilities for HDI projects and EMS manufacturing capabilities, including via filling for stacked vias. It provides 4-to-64-layer HDI PCB fabrication, assembly, and PCBA box-build assembly. You can order various HDI PCBs from PCBONLINE, such as FR4, polyimide (flexible PCB), polyimide + FR4 (rigid-flex PCB), and PTFE/Rogers (high-frequency PCB).

    HDI PCB assembly PCBONLINE

    The advantages of PCBONLINE in HDI PCB and PCBA manufacturing

    3000m² of production capacity per day for HDI PCBs with builds of 1+N+1, 2+N+2, 3+N+3,4+N+4, and arbitrary interconnection in any layers.

    PCBONLINE has hardware and software R&D capabilities for IoT applications requiring HDI design, including PCBA and enclosures.

    We can manufacture complex PCBs with stacker vias, via-in-pad, microvias, inlay boards, heavy copper designs, and hybrid and fine structure lay-ups.

    Besides HDI PCB fabrication, we have powerful capabilities in fine-pitch assembly for HDI PCB assembly.

    We have rich R&D and manufacturing experience for HDI applications such as FPGA boards.

    High-quality HDI PCB and PCBA manufacturing certified with ISO 9001:2015, IATF 16949, RoHS, REACH, UL, and IPC-A-610 Class 2/3.

    Here'e the PCB via filing capabilities at PCBONLINEL:

    • Micriavia filling with copper: laser via size 0.1-0.125mm, priority 0.1mm
    • Finished hole size for via-in-pad filling with resin: 0.1-0.9mm (drill size 0.15-1.0mm), 0.3-0.55mm normal (drill size 0.4-0.65mm)
    • Max aspect ratio for via-in-pad filling with resin PCB - 12: 1
    • Min resin plugged PCB thickness: 0.2mm
    • Max via-filling ith resin PCB thickness: 3.2mm
    • Making different hole sizes with via filling in one board: Yes
    • Via filling with copper/silver: Yes

    If you need HDI PCBAs or any other PCBAs requiring via filling, please send your email to PCBONLINE at info@pcbonline.com. We will provide one-on-one engineering support to you.

    Conclusion

    Via filling is used for creating stacked vias in HDI PCB fabrication, BGA/CSP/QFN IC packaging, and filling PCB via-in-pad with resin during multilayer PCB fabrication. If you need one-stop electronics manufacturing for your HDI PCBA project, contact the one-stop advanced PCB manufacturer PCBONLINE for high-quality PCBA and box-build solutions tailored to your project's needs.


    View and save our product information
    PCB fabrication at PCBONLINE.pdf

    GET A FREE QUOTE

    File Upload
    Please upload the file in only the zip, rar, or 7z formats.