Ceramic PCB Manufacturing Capabilities

Applications of Ceramic PCBs
- ● High-power electronic modules, solar panel components
- ● High-frequency switching power supplies, solid-state relays
- ● High-power LED lighting products
- ● Communication antennas
- ● Automotive sensors, refrigeration sheets, etc
Specifications
PCBONLINE's Ceramic PCB Capabilities
Layers
1, 2, 4
Build time
1 day to 4 weeks
Ceramic substrates
Al₂O₃ (alumina), SiC, BeO, AlN (aluminum nitride), Si₃N₄ (silicon nitride), hybrid materials
Maximum PCB size
138mm × 190mm
Finished board thickness
0.25mm, 0.38mm, 0.5mm, 0.76mm, 0.8mm, 1mm, 1.5mm, 2mm
Size tolerance
≤±50μm
Trace width/space
5-10μm: 0.05mm/0.05mm
HOZ: 0.075mm/0.075mm
1OZ: 0.1mm/0.1mm
2OZ: 0.127mm/0.127mm
3OZ: 0.3mm/0.3mm
6OZ: 0.5mm/0.5mm
9OZ: 0.6mm/0.6mm
Copper thickness
2μm to 105μm (DPC)
150μm to 300μm (DBC)