AlN and Alumina Substrate Ceramic PCB One-Stop Manufacturing

"Ceramic PCBs are normally aluminum nitride or alumina substrate circuit boards and feature excellent thermal conductivity, heat resistance, and electrical insulation."
ceramic PCB manufacturer

Ceramic PCB Manufacturing Capabilities

ceramic PCB structure

Applications of Ceramic PCBs

  • ● High-power electronic modules, solar panel components
  • ● High-frequency switching power supplies, solid-state relays
  • ● High-power LED lighting products
  • ● Communication antennas
  • ● Automotive sensors, refrigeration sheets, etc
Specifications
PCBONLINE's Ceramic PCB Capabilities

Layers

1, 2, 4

Build time

1 day to 4 weeks

Ceramic substrates

Al₂O₃ (alumina), SiC, BeO, AlN (aluminum nitride), Si₃N₄ (silicon nitride), hybrid materials

Maximum PCB size

138mm × 190mm

Finished board thickness

0.25mm, 0.38mm, 0.5mm, 0.76mm, 0.8mm, 1mm, 1.5mm, 2mm

Size tolerance

≤±50μm

Trace width/space

5-10μm: 0.05mm/0.05mm
HOZ: 0.075mm/0.075mm
1OZ: 0.1mm/0.1mm
2OZ: 0.127mm/0.127mm
3OZ: 0.3mm/0.3mm
6OZ: 0.5mm/0.5mm
9OZ: 0.6mm/0.6mm

Copper thickness

2μm to 105μm (DPC)
150μm to 300μm (DBC)

Solderability

＞95% (IPC-TM-650 2.4.14)

Advantages of the One-Stop Ceramic PCB Manufacturer PCBONLINE

Laser depaneling for round ceramic PCBs and diamond-cut for rectangular ceramic PCBs are available
Apply DPC manufacturing technology to realize three-dimensional circuit design
Ceramic PCBs without an oxide layer can be used for a long time in aggressive environments
Metal layers of ceramic PCBs with lower resistance and stronger adhesion
HDI manufacturing capability (minimum 20μm) to realize the small size, lightness, and thinness of products
The thickness of copper is arbitrarily customized from 1μm to 1mm from PCBONLINE

Ceramic PCB Certifications

Ceramic PCB Certifications

Lamination During Ceramic Multilayer PCB Manufacturing

ceramic PCB lamination
  • PCBONLINE adopts two different lamination methods in multilayer ceramic PCB fabrication according to specific requirements.
  • If PCBs require less thermal conductivity, we adopt the normal lamination method: in the PCB lamination process under high temperature and high pressure conditions, two ceramic substrate layers are bonded by a dielectric layer (PP). The PP materials are mainly phenolic, epoxy resin, special thermal conductive materials.
  • This process's manufacturing cost is low, but it drastically reduces the overall thermal conductivity of the ceramic circuit board, and its bonding strength is not as good as sintering lamination.
  • If the PCB requires high thermal conductivity, we use the sintering lamination method: in the PCB lamination process under high temperature and high pressure conditions, molecules of the two ceramic substrate layers' contact surfaces migrate, and the two layers integrate and form dense polycrystalline ceramics as a whole (relative density > 98%).
  • This technology bonds the copper and the ceramic base material together with a strong bonding force and high reliability. Meanwhile, the characteristics of the ceramic substrate are not affected, especially the thermal conductivity and flatness.

Direct Plating Copper (DPC) - Ceramic PCB Manufacturing from PCBONLINE

cceramic PCB manufacturing process
We adopt DPC technology, a ceramic circuit processing technology developed from ceramic thin-film processing, to manufacture ceramic circuit boards. The general process includes ceramic surface metalization, sputtering, copper plating, film exposure and development.
Our ceramic PCB manufacturing flow using the DPC technology is:
● First, we clean the ceramic substrate by pre-treatment.
● Next, we sputter the ceramic substrate by vacuum coating to bond to the copper composite layer.
● Then, we use the photoresist coating of yellow light for exposure, development, etching, and film removal to complete the circuit production.
● We increase the copper thickness by electroplating/electroless plating.
● Finally, we remove the photoresist, and the metalized circuit is done.
● Compared with the traditional thick film and thin-film processing technologies, the DPC technology we use provides faster processing, a micron-rating fine process, no ceramic type and thickness limit.

Ceramic PCB Depaneling from PCBONLINE

  • From PCBONLINE, ceramic PCB depaneling can be laser-cut or diamand-cut. (V-cut and CNC are impossible to depanel ceramic PCBs.)
  • ● Laser PCB depaneling: ceramic PCBs in round shape should be laser-cut to depanel. To protect the circuit from high temperatures, at the laser head nitrogen is added to lower the PCB temperatures. Then we will clean to remove the carbon along with the depaneling round line.
  • ● Demand PCB depaneling: diamond depaneling is similar to V-cut - the depaneling line has to be straight. Ceramic PCBs are depaneled under room temperatures, so you don't have to worry about carbonization. In addition, PCBs can be panelized on the production panel.
  • ● If possible, please design your ceramic PCBs as rectangular or squire as possible. But round ceramic PCB manufacturing is okay for us. We will provide professional engineering support to your project to penalize your ceramic PCBs and avoid carbonization.
Laminates

We are solution experts to Ceramic PCB projects
Contact our team here

Support Request
multilayer ceramic PCB

Ceramic PCB Examples

"This is one of the ceramic hybrid PCBs we fabricated for a Chinse client. It is for high-power LEDs for stage lighting. The PCB is copper-based with an AlN inlay area in the center, and COB LEDs are flip-chip bonded on the AlN. Besides copper/AlN hybrid PCBs, PCBONLINE also can fabricate copper/alumina, aluminum/AlN, and aluminum/alumina PCBs."

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