Do you the best and enhanced electrical performance? Are you looking for a lightweight and smaller size PCB? If so, you should go to HDI PCB with modern structures. HDI is the abbreviation of High-density interconnector. A circuit board with a higher wiring density per unit is termed as HDI PCB. It is distinct from the conventional board in structures, weight, and size. HDI PCB offers spaces and finer lines, micro vias and capture pads. It provides a higher connection pad density. You may enhance the electrical performance and size of equipment with HDI. If you want higher layer count and costly laminated boards with micro vias, HDI PCB is the top choice for you.
HDI PCBs are the result of the most recent technologies to amplify the performance of circuit boards through the little amount of area. The tininess of parts and semiconductor packages assist innovative products like touch screen gadgets. Its high-density feature comprises of laser micro via, high performing thin materials. HDI is better density gives space for extra functions per unit. You need extra precision than the commonly printed boards. There is a much lesser chance of harm from shocks.
AA printed circuit board is used to connect and support electronic components. A high-density PCB has conductive pathways to connect components. Based on PCB types, we use the following types of the lamination process.
Lamination of multiple layer PCBs
The circuit boards with various layers are called multiple layer PCBs. We bond these layers with lamination. You need to subject the internal layers under extreme temperature and pressure. The process is implemented with a photosensitive dry resist with fine imaging. Then PCB is placed under high temperature. Then the pressure is released slowly. The material then cools down.
If PCB has two or more subsets then we use a sequential lamination process. A separate process is done to create subsets of the multi-layer PCBs. We use a dry electronic substance between each pair of subsets. After this procedure, the standard manufacturing process is implemented. So the sequential lamination works.
Generally, we distinguish HDI boards by the number of Lamination and the number of laser drilling, for example: 1+N+1, 1+1+N+1+1,2-（N-1）
The mostly used HDI laminates for PCB lamination are PTFE microwave and FR4 mix laminates. and PTFE is different reasons for their popularity. It has consistent dielectric constant, very low electrical consumption, and tight thickness tolerance. Its component material is common due to which this lamination is in common use. You should choose the lamination type which best suits your application. If you want a more suitable consultation, you must contact the manufacturer. It all depends on the circuitry density of your application.
We use this technology in the design and fabrication of HDI PCB stacked via hole. Sometimes these via holes are staggered via holes. To connect very small diameter micro via we use this technology,such as blind and buried holes. To route fine pitch components. These micro via holes pay an important role in shrinking PCB size. We do not use holes for inserting a component lead or any other reinforcing material. If you want to connect outer surface micro via holes, you need sequential lamination. It is because of a very small drill and aspect ratio requirements on all drills. The process is usually associated with thermal pad technology.
So you are going for HDI PCB. But how to choose the quality material for your HDI PCB is not an easy task, but you may do it. Here is the process. Surely you want to take your PCB to the next level of high performance. It is the basic point of designing an HDI printed circuit. You will have to deal with, micro via, spaces, and finer lines. You will have to work with laser, small capture pads, and micro via. Signal integrity is an important thing to consider. You may go through different types and structures of HDI Stackup but with the laminated and mechanically drilled core. You need to create inner layers, sequential lamination as well as drilled micro via and final through holes with the laser. So ou can choose from the following brands.
PCBONLINE has been in the printed circuit boards market for the last 15 years. The company has vast experience in PCB manufacturing and designing various types of circuit boards. You may order any type of board with premier functionality.
HDI PCB factory of PCBONLINE has the capability to process mass production based on HDI micro-holes. it also has rich experience in different HDI PCB fabrication for different HDI PCB market applications.
A、All the staff is professional HDI PCB manufacturers with 3-12 years' experience in, so we ensured the high stability and reliability of HDI products from the technical level.
B、The high precision back drilling technology can reduce the equivalent series inductance through the hole to ensure the product signal transmission integrity.
|HDI Stack up||1+N+1，2+N+2，3+N+3(with copper filling)|
|Final board thickness||0.15-3.2mm|
|Min Drill Bit size||8mil|
|Hole size tolerance||
|Hole Position Tolerance||+/-2mil|
Line to PAD
Hard Gold Plating
SMD 40-2000u", GND 30-800u"
Au 1-5u", Ni 80-200u"
Au 1-50u", Ni 80-200u"
2.PCBONLINE will review your order as soon as possible after receiving it. If there is any problem, we will contact you immediately, on the contrary, if there is no problem, we will send you the quotation and delivery date.