Aluminum PCB

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What is the aluminum PCB

Heat is the biggest threat to LEDs and silicon semiconductors.With the rapid development of the electronic industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher.Aluminum PCB vs Copper PCB is undoubtedly one of the effective means to solve the heat dissipation problem.

Aluminum PCB( aluminum printed circuit boards ) is a kind of metal substrate copper-clad plate with good heat dissipation function. Generally, a single panel consists of three layers, namely, circuit layer (copper foil), insulation layer and metal base layer. Aluminum PCB vs FR-4 PCB, aluminum PCB can minimize the thermal resistance and provide excellent thermal conductivity. Compared with the ceramic PCB, its mechanical properties are excellent. In addition, the aluminum PCB has the following unique advantages:

1.Meet RoHS requirements;
2.In the PCB design, the heat diffusion is extremely effective treatment;
3.Reduce module operating temperature, extend service life, improve power density and reliability;
4.Reduce the assembly of radiators and other hardware (including thermal interface materials);Reduce module volume;Reduce components and assembly costs;

According to the material classification of the aluminum base, it can be divided into 1100,3003,5052,6061. The performance table of aluminum alloy is as follows:

Aluminum PCB Board Applications

1.High brightness LED lighting/backlight module
2.Power electronics (inverter, transistor, DC/DCconverter, regulator)
3.Automotive (regulator, power module)
4.Audio (equalizer, amplifier)

Why choose PCBONLINE Aluminum PCB

1.In the sheet Material aspect, we have our own sheet Material factory (Yugu Chemical Material Ltd.). Yugu company focuses on medium and high-grade aluminum substrate materials, using 3003, 5052, 6061 aluminum substrate materials, the thermal conductivity of 1.5w, 2W, 3W, 4W, the highest breakdown pressure of 4000V.

Yugu aluminum substrate materials

Item Condition Typical Value
YGA-4-1 YGA-4-2 YGA-4-3 YGA-4-4 YGA-4-5 YGA-4-6
Peel Strength(N/mm) A
After Thermal Stress
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
≥1.5
Surface Resistance(MΩ) A
C-96/35/90
≥10^6
≥10^5
≥10^6
≥10^5
≥10^6
≥10^5
≥10^6
≥10^5
≥10^6
≥10^5
≥10^6
≥10^5
Volume Resistivity(MΩ.cm) A
c-96-35/90
≥10^9
≥10^8
≥10^9
≥10^8
≥10^9
≥10^8
≥10^9
≥10^8
≥10^9
≥10^8
≥10^9
≥10^8
Break-Down Voltage(KV) D-48/50+D-0.5/23 ≥3 ≥4 ≥5 ≥8 ≥10 ≥12
Dielectric Constant(1MHz) C-96/35/90+R
ecovery
≤8 ≤8 ≤8 ≤8 ≤8 ≤8
Dissipation Factor(1MHz) C-96/35/90+R
ecovery
≤0.03 ≤0.03 ≤0.03 ≤0.03 ≤0.03 ≤0.03
Thermal Stress 288℃ 2min No Blistering, No delaminating
Flammability A V-0
CTI (V) A 600 600 600 600 600 600

2.Meanwhile, we also have other corresponding partners. The figure below shows the parameters of sheet material:

Ventec General Properties

Product Thermal Conductivity
(W/m*k)
Thermal Impedance
(℃*in²/W)
Dielectric Break Down
(Volt)
Tg
(DSC)(℃)
Td
(TGA)(℃)
Dk
(@1 MHz)
Df
(@1 MHz)
MOT
(℃)
Flammability
(UL 94)
without Glass reinforcement
VT-4B7 7.0 0.017 6000 100 380 4.8 0.016 130 v-0
VT-4B5SP 4.2 0.015 3000 120 380 4.8 0.016 130 v-0
VT-4B5L 3.6 0.034 7000 100 380 4.8 0.016 130 v-0
VT-4B5 4.2 0.029 7000 120 380 4.8 0.016 130 v-0
VT-4B3 3.0 0.040 7000 130 380 4.8 0.016 130 v-0
VT-4B1 1.0 0.117 6000 100 380 4.8 0.016 130 v-0
Glass reinforced
VT-4A2H 2.2 0.054 6000 130 380 5.1 0.014 105 V-0
VT-4A2 2.2 0.054 6000 130 380 5.1 0.014 90 V-0
VT-4A1 1.6 0.074 6000 130 380 5.0 0.015 90 V-0

TOTKING General Properties

Test Item Test Method Units Product model Index
T-110 T-111 T-112 T-113 T-311 T-411 T-511
Thermal Conductivity ASTM-D5470 W/m.k 1.5 2.0 3.0 1.8 2.0 2.0 3.0
Thermal impedance Internal
TO-220 Test
℃/W 0.65 0.55 0.45 0.6 0.6 0.6 0.45
Peel Strength IPC-TM-605
2.4.8
N/mm 2.0 1.8 1.6 1.3 1.8 1.8 1.8
Flammability UL94
2.4.8
Class V-0 V-0 V-0 V-0 V-0 V-0 V-0
288℃.Thermal Stress IPC-TM-650
2.4.13.1
S 120 120 120 120 60 60 60
Tg IPC-TM-650
2.4.25
100 100 100 100 100 100 100
1MHz.Dielectric Constant IPC-TM-650
2.5.5.9
- 5.5 6.5 7.0 6.0 6.5 6.5 6.5
Volume Resistivity IPC-TM-650
2.5.17.1
MΩ-cm 10^7 10^7 10^7 10^7 10^7 10^7 10^7
Surface Resistance IPC-TM-650
2.5.17.1
10^5 10^5 10^5 10^5 10^5 10^5 10^5
Dielectric Breakdown IPC-TM-650
2.5.6.2
KVAC 7.0 7.0 6.0 6.0 7.0 7.0 7.0
Typical Proof Test QB/JS-YF-002 KVAC 5.0 5.0 4.0 4.0 5.0 5.0 5.0
CTI IEC60112 V 600 600 600 600 600 600 600
Moisture Absorption IPC-TM-650
2.6.2.1
% 0.03 0.03 0.03 0.03 0.03 0.03 0.03
The Dielectric Layer Thickness of tested sample 0.1mm/4mil

POLYTRONICS General Properties

Item Test Method Test Condition Product Name(UL Type Name)
TCB-2L TCB-2
(TCB-2AL)
TCB-4 TCB-8
Thermal Conductivity [W/m-K] ASTM D5470 C-96/25/65 2 3 4 8
Typical Break Down Voltage [AC KV] JIS C 2110 C-96/25/65
E-1000/150
Solder Floating, 260℃/30 min
150℃ ~ -50℃/1000 cycles
C-1000/85/85
5.0 5.0 4.5 4.5
Typical Peeling Strength [N/cm] JIS C 6481 C-96/25/65 18 18 18 18
E-1000/150
Solder Floating, 260℃/30 min
150℃ ~ -50℃/1000 cycles
C-1000/85/85 14 14 14 14
Water Absorption IPC-TM-650 2.6.2.1 23℃/24hrs <0.5 <0.5 <0.5 <0.5
Dielectric Constant IPC-TM-650 2.5.5.1 C-96/25/65, 1MHz 4.6 4.8 4.9 5.2
Dielectric Loss Tangen IPC-TM-650 2.5.5.1 C-96/25/65, 1MHz 0.021 0.021 0.022 0.024
Capacitance IPC-TM-650 2.5.5.1 C-96/25/65, 1MHz 1.1 1.1 1.2 1.2
Surface Resistance IPC-TM-650 2.5.17.1 C-96/25/65, 1MHz >10^15 >10^15 >10^15 Under Evaluation
Volume Resistance IPC-TM-650 2.5.17.1 C-96/25/65, 1MHz >10^13 >10^13 >10^14 Under Evaluation
Glass Transition Temp IPC-TM-650 2.4.25 DSC 130 130 140 140
Thermal Resistance JIS C 6481 Solder Floating, 260℃ >60 >60 >60 >60
IPC-TM-650 2.4.24.1 TMA T260 >60 >60 >60 >60
T288 >30 >30 >30 >30
T300 >2 >2 >3 >2
Decomposition Temp. IPC-TM-650 2.4.24.6 TGA 2%
%5
350
400
350
380
350
400
350
400
Thermal Expansion IPC-TM-650 2.4.24.5 TMA > Tg
< Tg
37
24
30
20
25
16
35
28
Thermal Expansion IPC-TM-650 2.4.24.5 TMA 50~260℃ 0.68 0.54 0.52 0.58
Comparative Tracking Index UL 746E C-40/25/50 600 600 600 600
Flammability UL 94 C-40/25/50 V-0 V-0 V-0 V-0

3.Not only have our own sheet material, PCBONLINE is also an aluminum PCB manufacturer specializing in the production of aluminum PCB in China, and we have rich experience in the production of aluminum PCB.
A.Because the rigidity of aluminum-based material is much harder than that of FR4, the machines used by PCBONLINE are all customized for making aluminum substrate, so as to improve the problems of breaking knives and burrs;
B.Ink printing has always been a difficult aspect to control in the production of aluminum PCB, especially white ink. In many cases, when the aluminum PCB is SMT patch, after reflow welding, the ink will turn yellow. The ink used by PCBONLINE is TAIYO and other international brand ink, which ensures that the ink will not yellow.
C.Double-sided aluminum PCB. PCBONLINE has its own sheet material factory. The ceramic filler is adopted in the insulation layer of all double-sided aluminum substrate to ensure thermal conductivity and plate non-layering and other undesirable issues.

4.During aluminum PCB design, it is necessary to control the spacing size of the circuit and the distance between the circuit and the edge of the plate. If the circuit is too close to the edge of the plate, the finished plate is prone to creepage when voltage is applied, leading to the breakdown of the plate and scrap.If you have any questions during the design process, please contact us and we will provide you with a reasonable solution

5.PCBONLINE can reduce your aluminum PCB cost while you getting a high-quality board.In addition, we have in-depth research on other aluminum-related products. E.g: aluminum Nitride PCB 、flexible aluminum PCB、aluminum flex PCB、aluminum foil PCB、aluminum PCB for led, and so on.

In many countries, Aluminum PCB also known aluminum foil PCB、aluminum clad PCB、aluminum backed PCB、aluminum core PCB、aluminum PCB prototyping、aluminum PCB LED. And if you have any questions about Aluminum PCB stack up, please feel free to contact

If you have any questions about carbon ink,carbon fiber PCB or calculation formula of carbon ink in the design process, please feel free to contact us.

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