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PCB Assembly Inspections Capabilities
Applications of PCB Assembly Inspections
- ● PCB assembly inspections are necessary during and after PCBA manufacturing
- ● The AOI happens in PCB fabrication and PCB assembly process to prevent significant defects
- ● The X-ray inspection detects the solder balls at the bottom of BGAs before reflow soldering
- ● The functional test ensures the PCB assemblies play the required functions
- ● The burn-in test simulates the work environment to ensure the product reliability in continuous use
- ● The first article inspection allows you to review the sample test report before bulky production
Specifications
PCBONLINE's PCB Assembly Inspection Capabilities
PCB assembly standard
IPC-A-610 Class 2/3
Inspection before bulky production
First article inspection, IC counterfeit inspection
Inspections on PCB assembly lines
3D solder paste inspection, X-ray, visual inspection, 3D AOI
Inspections in the pro-assembly stage
Functional jig test, burn-in test
Maximum board size
1200mm × 370mm
Minimum board size
50mm × 50mm
Maximum rectangular part size
50mm × 150mm
Maximum square part size
74mm × 74mm
Maximum component height
25mm
PCB thickness
0.3mm to 4mm
Finest pitch
0.35mm
Minimum SMD package
01005 (0.4mm × 0.2mm)
