Hight Frequency PCBs

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The trait of high-frequency PCB

1. High frequency PCB must use low water absorption of the substrate if use high water absorption will be affected by moisture dielectric constant (Dk) and dielectric loss (Df).
2. The thermal expansion coefficient of the high speed high frequency PCB substrate and copper foil must be consistent, otherwise, it will cause copper foil separation.
3. High frequency signal PCB substrate dielectric constant (Dk) must be small and stable. Generally speaking, the smaller the better, because of the signal transmission rate and the square root of the material dielectric constant is inversely proportional. The high dielectric constant is easy to cause signal transmission delay.
4. PCB for high frequency substrate material dielectric loss (Df) must be small. Dielectric loss (Df) mainly affects the quality of signal transmission, the smaller the dielectric loss, the smaller the signal loss.
5. High frequency PCB materials also require high heat resistance, chemical resistance, impact strength, and peel strength

By the utilization of high frequency PCB materials in the progress of the circuit board, you will have many impressive benefits:

Controlled Impedance:

The High frequency board materials, like, the upgraded epoxy or the PTFE will retain that DK (dielectric constant) tolerances at the +/- 2% or enhanced. For circuits that request fitted controlled impedance steering, the dielectric constant turns into a significant thought for testing the applications.

Signal Performance:

Another significant thought is in the signal execution with the PCB. Signal misfortune turns out to be all the more an issue as transmission line frequency raise. The Upgraded epoxy or the PTFE materials could offer you a much lower scattering factor which in result diminishes the signal loss.

Dimensional Stability:

The High-frequency PCB structures need to keep up tight the physical tolerance both in their assembling and the usage. Thermoset hydrocarbon overlay materials are a decent decision for mechanical reliability.

Reduced Moisture:

Another thought is the humidity ingestion rating of the materials utilized in the PCB. Indeed, even a limited quantity of wetness can change the electrical presentation of the high-frequency circuits. Conventional FR-4 can have a humidity assimilation rating as high as half while materials, for example, PTFE can get as low to 2%.

Thermal Management:

The High frequency strategies will often achieve more warmth in their materials, and activity, for example, the polyimides are enormously strong with remarkable thermal properties. This likewise settles on them a decent decision for the circuit boards that will be utilized in sever conditions.

The above list highlights a cluster of advantages that high speed PCB can offer you. There are anyway different contemplations also.

Other Considerations for Using the High Frequency Board Materials

As you know, there is a certain cost to pay for the advantages of these materials, and the first to consider is the genuine expense. High frequency PCB materials are more costly than ordinary materials. You have to take a gander at the exchange offs among cost and execution and have to choose which one is the better approach. Another thing to consider is to make sense of how much performance improvement your circuits boards really want.

Another thought is that the high frequency PCB are progressively hard for the PCB manufacturing companies to work with. A portion of the PTFE covers for example, which have incredible electrical properties, require non-standard manufacturing processes. This will likewise move up your costs which should be considered into your general choice too.

The thing that should do is to counsel your online PCB designer before you start your PCB design or getting quote for your PCB to figure out which are the best material decisions. Your CM can likewise assist you with determining the suitable board layer stack up procedure which they might send direct to the CAD apparatuses through an IPC-2581 arranged document.

Factors to see while having high Frequency PCB designs

Before you pick the High Frequency PCB and reasonable material for your venture, you should bring hardly these things into observations:

Dielectric constant

Dielectric constant is the capacity of material to store vitality in its electric field. It is subject to the heading of the material for example it will change as the hub of material changes. It must be sufficiently little, so it conveys stable contribution to request to stay away from any deferral in the communication signal in the PCB.

Dissipation Factor

Likewise, Dissipation Factor must be little, since high DF can seriously impact the nature of the communication signal. So less DF will relate to less signal loss in the PCB.

Loss Tangent

Loss tangent is basically the measure of signal loss in the PCB substrate. Loss Tangent is another factor to be considered which is dependent on the material’s molecular structure that can impact the RF material containing the high frequencies. Be that as it may, it isn't of much worry for the low frequency signals. But the loss tangent is a great factor to consider when using the high frequency PCB for electrical applications.

Proper dispersing

Proper dispersing is significant as far as skineffect and cross talk are concerned. Crosstalk happens when the board begins collaborating with itself and relates to undesired coupling with their own segments. So as to evade crosstalk, separation among plane and trace must be least in the PCB.

Skineffect is straightforwardly associated with the obstruction of the traces. It begins expanding when obstruction builds which at last outcomes in warming the board. So the trace width and length must be chosen such that it cannot impact the board at higher frequencies in the finished PCB.

Smaller Diameter and Peel Off Resistance

Smaller breadth vies low conductance and are generally reasonable as frequency go higher. And higher the estimation of Peel off resistance, heat resistance and sway endurance, the better the nature of the signal in the PCB. Peel off resistance is basically the capability of solder mask in holding onto the PCB. So, for a material to be useful, it should have strong peel off resistance. Also for the heat resisting property, this peel of resistance must be appropriate.

The Coefficient of thermal expansion

The Coefficient of thermal expansion in the PCB characterizes the impact of temperature on the size of material. It broadly impacts on the penetrating and assembly procedure of the PCB, because a small change in temperature can seriously change the material’s size of the circuit board. Thermal expansion of copper foil should be same, since contrast in thermal expansion may bring about the division of copper foil, on the off chance that PCB material is exposed to evolving temperature.

Environment

Environment is a major concern wherein your gadget is working on some application. On the off chance that your gadget is utilized in Lab or indoor atmosphere, then humidity won't be a major issue. Issue emerges when your gadget is uncovered in wet condition. So, water retention of the material ought to be low, since high absorption factor may adjust the DK and DF esteem in the humidity of the PCB.

Why choose PCBONLINE high frequency PCB

PCBONLINE is a professional PCB prototype manufacturer with 15 years of experience in China. Master all kind of high-frequency materials and manufacturing requirements, rich experience in various high-frequency circuit design, material brand, specifications, thickness (mm), dielectric constant (ER).

1. Cooperate with famous brands of advanced high-frequency materials to ensure the quality of your products

A、Common stock sheet and parameters

Name Type Thickness(mm) er
F4B F4B
F4B
F4B
F4Bk
F4B
FE=F4BM
0.38
0.55
0.225、0.3、0.5、08、1、1.2、1.5、2、2.5、3.0
0.8、1.5
0.8
1
2.2
2.23
2.65
2.65
3.5
2.2
Rogers RO3533
RO4350
RO4003
0.8
0.254 0.508、0.8、1.524
0.508
3.3
3.5
3.38
TACONIC TLF-35
TLA-6
TLX-8
RF-60A
TLY-5
TLC-32
TLA-35
0.8
0.254、0.8、1、1.5
0.254、0.8、1、1.6
0.64
0.254、0.508、0.8
0.8、1.5、3
0.8
3.5
2.65
2.55
6.15
2.2
3.2
3.2
ARLON AD255C06099C
MCG0300CG
AD0300C
AD255C03099C
AD255C04099C
DLC220
1.5
0.8
0.8
0.8
1
1
2.55
3.7
3
2.55
2.55
2.2

A、Performance index

Item Value
Conductor width control ±0.02mm
Hole wall copper ≥ 20μм
Thermal stress 288°C.10sec.
Permitivity ε2.1-10.0
Profile:punching or routing.tolerance ±0.10.0-0.13mm
final product thickness 0.5,0.8,1.0,1.2,1.6mm
Base copper thickness Normal 0.5 1.0 OZ
Solder Mask Taiyo PSR4000.Tamura DSR2200
Solder mask thickness on tracks 20-30 μм

2、Mature process of PCB technology and rich production experience

High-frequency board performance and production process is special, in order to produce the best products, the manufacturer must have rich experience in processing production. PCBONLINE high-frequency PCB manufacturing is controlled from the following points

A、High frequency microwave board is used to transmit high frequency signals. The impedance control requirements of finished PCB wires are strict. The line width tolerance of the printed circuit board is usually ±0.02mm (even ±0.015mm).Therefore, from the perspective of engineering data, our engineers will compensate the line width according to different copper thickness, and the etched board will measure the line width 100% to confirm whether it is within the tolerance range.

B、The high-frequency signal PCB design transmits high-frequency signal rather than current. Pit, notches, pinholes and other defects in the circuit line will affect the transmission effect, and any such minor defects are not allowed in the high-frequency PCB layout. Therefore, after the film is drawn, it must be checked to ensure that there are no pinholes or gaps in the film. The most difficult procedure of high-frequency board fabrication is chemical copper sinking. All holes must have copper and no blank. PCBONLINE adopts Plasma method, which is to inject carbon tetrafluoride (CF4) or argon (Ar2) nitrogen (N2) and oxygen (O2) gas between two high-pressure electrodes under the vacuum environment. The printed board is placed between two electrodes, and the Plasma is formed in the cavity, so as to remove the drilling dirt and dirt in the hole.

C、Solder resistance thickness is also strictly controlled and lines solder mask too thick or too thin for several microns can be disqualified.

D、The final destructive test must be carried out in manufacturing: thermal shock 288℃, 10 seconds, 1~3 times, to ensure no separation of hole wall.

3、Superb process capability, tailor-made for you exclusive technology

4、Advanced production equipment to ensure the processing accuracy of each piece of HF PCB