PCB Capability

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1.rigid capability download

Material (ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180): ShengYi, ITEQ, KB, TUC,Ventec,Isola,Doosan High Speed FR4, Ceramics & Telflon, Rogers
Layer count 1~24
HDI Stack up 1+N+1,2+N+2,3+N+3(with copper filling)
Final board thickness 0.15-3.2mm
Aspect Ratio Laser via
PTH
3:4
10:1
Copper thickness 1/3~6oz
Impedance Control Single Ended
Differential
+/- 10%
+/- 10%
Line/Space Inner Layer
External Layer
2.5/2.5mil
2.5/2.5mil
Min Drill Bit size 8mil
Hole size tolerance PTH
NPTH
+/-3mil
+/-2mil
Hole Position Tolerance +/-2mil
Profile Tolerance Puching
Routing
+/-3mil
+/-4mil
Soldermask Line to PAD
Registration
4mil
+/-2mil
Warpage 0.5%
Surface Finish HASL(LF HASL)
ENIG
OSP
Immersion Tin
Immersion Silver
Hard Gold Plating
Peelable Mask
Carbon ink
SMD 40-2000u", GND 30-800u"
Au 1-5u", Ni 80-200u"
 
0.8-1.2um
0.15-0.45um
Au 1-50u", Ni 80-200u"
5mil
0.3mil
Remarks Peelable Mask 5mil
Carbon ink 0.3mil
Mixed Surface Finishes OSP+ENIG, OSP+HASL
Heavy Copper External layers up to 12oz
Long PCB max 1.5m for DS
(High R) Carbon Available
Gold finger Available
Jump V-Cut Available
PCB Edge plating Available
Countersink & Counterbore Available
Sequential lamination Available
Step Routing Available

2.Flex-rigid capability download

Material Polyimide: Taiflex, Shengyi
Layer count 1~6
Final board thickness 0.05-0.6mm
Aspect Ratio 3:1
Copper thickness 1/3~3oz
Impedance Control Single Ended
Differential
+/- 10%
+/- 10%
Line/Space Inner Layer
External Layer
1.6/1.6mil
1.6/1.6mil
Min Drill Bit size 6mil
Hole size tolerance PTH
NPTH
+/-2mil
+/-1mil
Hole Position Tolerance +/-2mil
Coverlayer Line to PAD
Registration
6mil
+/-2mil
Profile Tolerance Puching
Laser Cutting
+/-3mil
+/-2mil
Surface Finish ENIG
OSP
Immersion Tin
Immersion Silver
Hard Gold Plating
Au 1-5u", Ni 80-200u"
 
0.8-1.2um
0.15-0.45um
Au 1-50u", Ni 80-200u"

3.MPCB capability download

Base Material Aluminum(Larid, Ventec,Yugu Boyu), Iron and Copper isolation base
Max dimension 1200mm* 300mm
Copper foil thickness 0.5-10OZ
Dielectric thickness 0.075-0.15mm
Finish Thickness 0.5-3.2mm(+/-10%)
line width/Gap/td> 1OZ
2OZ
3OZ
4OZ
0.15/0.12MM
0.18/0.15MM
0.25/0.2MM
0.3/0.25MM
Soldermask opening 0.05mm
Surface finish ENIG,OSP,HASL(LF HASL),Immersion Tin,Immersion Silver
Peel strength ≥ 1.8 N/mm
Surface resistance ≥ 1*10^5 M
Volume resistrivity ≥ 1*10^6 M
Solder fioat 260℃,10Min ,No layerig,No sparkling
Permittivity ≤ 4.4
Disspation factor ≤ 0.03
Thermal conductivity 1.0~4.2W/m.k
Hi-pot Withstand 2~6KV
Surface Finish HASL
LF HASL
ENIG
OSP
SMD 40-2000u", GND 30-800u"
SMD 40-2000u", GND 30-800u"
Au 1-5u", Ni 80-200u"
 

4. Rogers capability download

Material Rogers
Permitivity ε2.1-10.0
Products RO4350B,RO4450,RO4835,RO3003C,RO3000,RO4000,RO1200
Layer count 1~8
Mixed pressure Rogers+FR4 , Rogers+AL
Final board thickness 0.6-6.0mm
Aspect Ratio PTH 8:1
Copper thickness 1~2oz
Impedance Control Single Ended
Differential
50+/- 10%
90+/- 10%,100+/- 10%
Line/Space Inner Layer
External Layer
5/5mil
5/5mil
Min Drill size 11.81mil
Hole size tolerance PTH
NPTH
+/-3mil
+/-2mil
Hole Position Tolerance +/-2mil
Profile Tolerance +/-4mil
Soldermask Line to PAD
Registration
4mil
+/-2mil
Warpage 0.5%
Surface Finish ENIG
Immersion Tin
Immersion Silver
Au 1-5u", Ni 80-200u"
0.8-1.2um
0.15-0.45um
Remarks Remarks

5. Ceramic wafer capability download

Material Al 2 O 3 ,AlN
Layer count Single layer and Double side
Max unit size 140*190mm
Profile Tolerance +/-50um
Line/Space 75/75um
Min drill size 50um
Copper thickness 2-210um
Copper filling Aspect Ratio 5:1
Copper peel strength >2N/mm(per IPC-TM-650 2.4.8)
Heat Risistance 350±10℃,15min(per IPC-TM-650 2.4.7)
Solderability >95%(per IPC-TM-650 2.4.14)
Finish ENIG
OSP
ENEPIG
Immersion Silver
Au 1-5u", Ni 80-200u"
 
Ni:2-6um, Au:0.03um min, Pd:0.03um min
0.15-0.45um

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